Boyd Corporation is a world-leading innovator of technologies in material science, engineered materials, and thermal management that seal, protect, interface with, and cool our customers’ most critical applications. Our solutions maximize performance in 5G infrastructure and the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems, enable performance critical aircraft and defense technologies; and accelerate innovation in next-generation electronics and human-machine-interface.
Heat Sinks Stainless Steel Clip for TO-218, TO-220 Transistor Case, #50, Kool-Klip
Thermal Interface Material, PAD, 87, 0.410X00.750, W/.156HOLG | Boyd 188761F00000G
Thermal Interface Products In-Sil-8 Pad for TO-3, TO-220, TO-218, Rust, 0.009 Inch Thickness
Heat Sink - TO-5 - Cylindrical - Aluminum - 1.0W @ 60°C - Top Mount - Black Anodized.
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