MCP3424-E/SL

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• EE-WERKZEUGKASTEN
  

• Datenblatt

• PCN - 17-May-2017 - QUALIFICATION OF 98 X 235 MILS LEAD FRAME PADDLE SIZE AVAILABLE IN SELECTED 14L SOIC PACKAGE AT MMT

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 14-May-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 160K & 150K WAFER TECH AVAILABLE IN 14L S

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 19-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER BOND WIRE IN SELECTED PRODUCTS OF THE WAFER TECHNOLOGIES

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 30-Jul-2010 - QUALIFICATION OF THE 14L & 16L SOIC (.150) AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

• PCN - 22-Feb-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

• PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 12-Jun-2017 - UPDATED QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

• PCN - 15-Oct-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 14-May-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 160K & 150K WAFER TECH AVAILABLE IN 14L S

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 17-May-2017 - QUALIFICATION OF 98 X 235 MILS LEAD FRAME PADDLE SIZE AVAILABLE IN SELECTED 14L SOIC PACKAGE AT MMT

• PCN - 23-Jun-2017 - QUALIFICATION OF 98 X 235 MILS LEAD FRAME PADDLE SIZE AVAILABLE IN SELECTED 14L SOIC PACKAGE AT MMT

• PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

• PCN - 22-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 19-Apr-2010 - Microchip is announcing the Qualification of the 14L & 16L SOIC (.150) at GTK (GRTK) assembly site i

• PCN - 15-Nov-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 14L SOIC PACKAGE

• PCN - 15-Nov-2015 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR PRODUCTS AVAILABLE 14L SOIC PACKAGE

• PCN - 23-Jun-2017 - QUALIFICATION OF 98 X 235 MILS LEAD FRAME PADDLE SIZE AVAILABLE IN SELECTED 14L SOIC PACKAGE AT MMT

• PCN - 09-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER BOND WIRE IN SELECTED PRODUCTS OF THE WAFER TECHNOLOGIES

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 24-May-2017 - QUALIFICATION OF 98 X 235 MILS LEAD FRAME PADDLE SIZE AVAILABLE IN SELECTED 14L SOIC PACKAGE AT MMT

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 12-Jun-2017 - UPDATED QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS

• Product Change Notification