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Image is representational - see mfr. specs
593202B03500G
Boyd Laconia LLC
The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor ...
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Beschreibung
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The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
Search Keywords: 593202B03500G
Spezifizierung
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Product AttributeAttribute Value Select Attribute
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Lieferant:Boyd Laconia LLC
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Artikelnummer:593202B03500G
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Alias/AKA:042686
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Maßeinheit:Per Each
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RoHS (Beschränkung gefährlicher Stoffe):Yes
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HTS:8473309000
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COO:CN
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ECCN:EAR99
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Standardmenge:
800 -
Device Cooled:TO-220
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Attachment Method:N/A
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Dimension:35.05 x 12.2 x 50.8mm
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Thermal Resistance:10.4 °C/W
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Finish:Black Anodized
Tools/3D Models
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Ressourcen
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Datenblatt
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
Vorrätig:
8,045
Versand heute, if you order in
MOQ für In-Stock-Menge:
5
MOQ für Out-of-Stock-Menge:
400
6 Weeks
Kan verzenden
2/7/26
PRICE (EUR)
MENGE
Stückpreis
5
€2.579
100
€0.658
250
€0.645
400
€0.620
800
€0.603
1 200
€0.600
1 600 +
€0.597
Click for Quote
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