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Image is representational - see mfr. specs
530614B00000G
Boyd Laconia LLC
The 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semi ...
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Beschreibung
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The 530614B00000G is an aluminum, channel-style board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
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Spezifizierung
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Product AttributeAttribute Value Select Attribute
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Lieferant:Boyd Laconia LLC
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Artikelnummer:530614B00000G
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Alias/AKA:001725
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Maßeinheit:Per Each
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RoHS (Beschränkung gefährlicher Stoffe):Yes
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HTS:8473309000
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COO:CN
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ECCN:EAR99
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Standardmenge:
2000 -
Device Cooled:TO-220
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Attachment Method:Screw
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Dimension:25.4 x 29.97 x 12.7 mm
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Thermal Resistance:16.7 °C/W
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Finish:Black Anodized
Tools/3D Models
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Datenblatt
Learn more about BOYD Board Level Heat Sinks
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We’ll meet or beat any authorized competitor’s published price for this part.
Vorrätig:
3,526
Versand heute, if you order in
Minimum Order Quantity:
10
6 Weeks
Kan verzenden
2/7/26
PRICE (EUR)
MENGE
Stückpreis
10
€2.72
50
€2.43
250
€2.23
500
€2.15
2 000
€2.00
4 000 +
€1.99
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