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PIC24HJ128GP506-I/PT by microchip technology

Abbildung dient nur als Referenz - siehe Herstellerspezifikationen

Microchip Technology Autorisierter Händler

PIC24HJ128GP506-I/PT

PIC 24H microcontroller - MCU 16 bit - 3 V to 3.6 V - Pins: 64 - Package type: TQFP 64 – Speed 40 MHz – Flash 128 KB – SRAM 08 ...

Datenblatt anzeigen Datenblatt fragen Zubehör Benachrichtigen

RoHS-konform

TRAY Verpackung

Konformitätsbescheinigung

Dieses Produkt erfordert möglicherweise zusätzliche Dokumentation. Der Versand kann sich um 1-2 Tage verzögern.

Beschreibung +

PIC 24H microcontroller - MCU 16 bit - 3 V to 3.6 V - Pins: 64 - Package type: TQFP 64 – Speed 40 MHz – Flash 128 KB – SRAM 08 Kbytes - I/O: 53 – A/D: 10 bit with 18 channels – 05 Timers – 02 x UART – 02 x SPI – 02 x I2C – CAN - 360,600 mg – SMD/SMT - ICS

Suchbegriffe: PIC24HJ128GP506IPT

Spezifizierung +

Produktattribut

Attributwert Attribut auswählen
Gefundene Produkte: 0 Anzeigen Similar
Lieferant:

Microchip Technology
Artikelnummer:

PIC24HJ128GP506-I/PT
Maßeinheit:

Pro Stück
RoHS:

Ja
HTS:

8542310020
COO:

TH
ECCN:

3A991.a.2
Standardverpackung des Lieferanten:

160
ADC-Auflösung:

12 bit
Anzahl der programmierbaren I/Os:

53
Programmspeichergröße:

128 KB
Programmspeichertyp:

Flash
RAM-Größe:

8 KB
Betriebstemperatur:

-40 to 85 °C

Werkzeuge/3D-Modelle +

EE-WERKZEUGKASTEN

Ressourcen +

Datenblatt

Produktänderungen +

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 12-May-2008 - Modifications have been made to the 16-bit MPLAB C libraries for the self-programming routines_write

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 07-Apr-2013 - Errata-Pic24Hjxxxgpx06/X08/X10 Family Silicon Errata And Data Sheet Clarification

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 01-Sep-2009 - MPLAB C FOR PIC24/DSPIC V3.20 RELEASED

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 06-Mar-2006 - Product Change Notice

PCN - 27-Sep-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 03-Aug-2010 - Mcrochip is announcing the qualification of the listed YGAGx products at an additional wafer fabrica

PCN - 01-Sep-2010 - Qualification Of Ygagx Products At An Additional Wafer Fabrication Site

PCN - 10-Nov-2011 - Microchip is announcing the qualification of YGAN, YGAZ, YGAH, YGAQ, YGAR, YGAS, YGAU, YGAW, YGAY, U

PCN - 04-Mar-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 25-Aug-2011 - Microchip is announcing the qualification of YGAB, YGAG, YGAE, YGAK, YGAP, and UDAA masks without po

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 03-Mar-2009 - MPLAB C COMPILER DSPIC DSCS V3.12 HAS BEEN RELEASED TO THE WEB

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 02-Sep-2011 - MPLAB C FOR PIC24 AND DSPIC V3.30 RELEASED.

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 15-Apr-2011 - Qualification Of Ygab, Ygag, Ygae, Ygak, Ygap, And Udaa Masks Without Polyimide Process.

Frequently Asked Questions

Is PIC24HJ128GP506-I/PT RoHS compliant?

Yes, PIC24HJ128GP506-I/PT is RoHS compliant.

What is the lead time for PIC24HJ128GP506-I/PT?

The standard lead time for PIC24HJ128GP506-I/PT is approximately 30 days. In-stock quantities ship from OnlineComponents.com.

Dieses Produkt wurde eingestellt, ist aber noch auf Lager.
Dieses Produkt ist NICHT RoHS-konform. Siehe Alternative
Verschiedene Produktoptionen verfügbar. Siehe Alternative
Verschiedene Verpackungsoptionen verfügbar. Siehe Alternative
Mögliche Ersatzoptionen verfügbar. Siehe Alternative
Lokalisiert: Item discontinued
Steuer
Lokalisiert: Item discontinued

Vorrätig: 480

Versand heute, Geben Sie den Einstellungswert ein.

MOQ für In-Stock-Menge:

5

MOQ für Out-of-Stock-Menge:

40

LIEFERZEIT AB PRODUKTION:

30 Wochen Kan verzenden 19/3/27

Preis (EUR)

MENGE

Stückpreis

Ihr Preis

5

€7.28

€7.26

10

€7.03

€7.01

25

€6.45

€6.43

40

€6.39

€6.37

80

€6.20

€6.18

120

€6.07

€6.05

160 +

€6.06

€6.05

Standardverpackung des Lieferanten

Bestellung planen

Sie können Freigabemengen und Versanddaten im Warenkorb planen.