Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Heat Sink Passive BGA Pin Array Aluminum Black Anodized
45.0 x 45.0 x 24.5 mm BGA Heat Sink High Performance Cross Cut adhesive thermal tape Aluminum Black Anodized
Heat Sink Passive TO-220 Radial Thru-Hole Aluminum Black Anodized
Solid State Relay - 4-32 VDC Control Voltage Range - 82.5 A Maximum Load Current - 0.05 A Minimum Load Current - ...
Heat Sink Passive TO-218/TO-220/TO-247 Solderable Wave Aluminum 2.7 °C/W Black Anodized
35.0 x 35.0 x 17.5 mm BGA Heat Sink - High Performance Straight Fin/superGRIP Heat Sink Clip Anodized Aluminum
Extruded Heat Sink - TO-218 - 3.5 mm Vertical Solder Pin
Heat Sinks Extrusion, 61820-8 Foot Bar (96.5 Inch)
Bonded Fin Heatsink, BFIN, 476400U00000G | Boyd 476400U00000G
BGA Heat Sink - 37.4 x 37.4 mm - Aluminum - PCB
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