Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Bluetooth 4.2 Low Energy module
Bluetooth Class I/Class II 3.3V 2.178Mbps 24-Pin SMD Module T/R
Module 802.11b/g 2.48GHz 1000Kbps 44-Pin SMD Tray
RF Receiver ASK/OOK 5V 16-Pin QSOP EP T/R
Bluetooth® 5.2 Secure Wireless MCU for Automotive
RF Transceiver FSK/GFSK 3.3V 47-Pin Tray
802.15.4 SOC 2400MHz 2000Kbps 64-Pin SMD Module T/R
Radio SoC, Bluetooth® 5.2 Certified for Automotive 48-pin QFN for Automotive Applications
ZigBee/MiWi RF Transceiver 2.4 Ghz IEEE/ZigBee transceiver
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