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Available Replacements
Non-RoHS Equivalent
536280-3
536280-3

TE Connectivity / AMP Brand

有存货: 80

起订量: 3

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536274-3 by te connectivity / amp brand
Image is representational - see mfr. specs

536274-3

TE Connectivity / AMP Brand

PLUG ASSEMBLY, 10.92[.430] STACK, 3.68[.145] ACTION PIN TAIL, BOARD TO BOARD, MICRO-STRIP

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产品说明书 附件

符合 RoHS 规定
Discontinued
包装
Certificate of Compliance Guarantee
描述 +
PLUG ASSEMBLY, 10.92[.430] STACK, 3.68[.145] ACTION PIN TAIL, BOARD TO BOARD, MICRO-STRIP
Product Highlights:
  • Connector
  • Housing Gender = Plug
  • 80 Positions
  • Vertical Mount Angle
  • PCB Termination Type = Press-Fit
Search Keywords: 5362743
规格 +
  • Product Attribute
    Attribute Value Select Attribute
  • 供应商:
    TE Connectivity / AMP Brand
  • 部件编号:
    536274-3
  • 计量单位:
    Per Each
  • RoHS:
    Yes
  • ECCN:
    EAR99
  • 供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Board-to-Board Configuration:
    Vertical
  • Contact Type:
    Pin
  • Packaging Method:
    Tube
  • Circuit Application:
    Signal
  • PCB Mount Alignment:
    Without
  • Pick and Place Cover:
    Without
  • Cover Material:
    Phosphor Bronze
  • PCB Thickness (Recommended):
    .76 in
  • Busbar Termination Area Plating Material:
    Tin-Lead with Nickel underplated
  • Contact Base Material:
    Phosphor Bronze
  • Mating Alignment:
    With
  • Product Type:
    Connector
  • Connector Mounting Type:
    Board Mount
  • Busbar Mating Area Plating Thickness:
    30
  • Operating Temperature Range:
    -65 – 125 °C, -85 – 257 °F
  • Mating Alignment Type:
    Polarization
  • Number of Positions:
    80
  • Contact Mating Area Plating Thickness:
    30 µin, .76 µm
  • Packaging Quantity:
    10
  • Housing Material:
    High Temperature Thermoplastic
  • Insulation Resistance:
    2 MΩ, 80 VAC
  • Connector Type:
    Connector Assembly
  • Connector System:
    Board-to-Board
  • Termination Method to Printed Circuit Board:
    Through Hole - Press-Fit
  • PCB Contact Termination Area Plating Material:
    Tin-Lead
  • PCB Mount Orientation:
    Vertical
  • Profile:
    Low
  • Busbar Mating Area Plating Material:
    Gold
  • For Use With:
    Receptacle Assembly
  • Busbar Material:
    Phosphor Bronze
  • Stackable:
    Yes
  • Flame Retardant:
    Yes
  • Number of Rows:
    2
  • PCB Mount Retention:
    With
  • Voltage:
    30 VAC
  • Contact Current Rating (Max):
    10.5 A
  • PCB Contact Termination Area Plating Thickness:
    25 – 75 µin
  • Row-to-Row Spacing:
    .1 in, 2.54 mm
  • Stack Height:
    .43 in, 10.92 mm
  • Contact Mating Area Plating Material:
    Gold
  • Connector Assembly Type:
    PCB Mount Header
  • Height:
    .34 in, 8.64 mm
  • PCB Mount Retention Type:
    Action/Compliant Tail
  • Connector & Contact Terminates To:
    Printed Circuit Board
  • Tail Length:
    .145 in
  • Centerline (Pitch):
    .05 in, 1.27 mm
  • Solder Process Feature:
    Board Standoff
  • Boss:
    No
  • Sealable:
    No
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  • Item discontinued
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