MCP9808T-E/MC

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• 電子工程工具箱
  

• 数据表

• PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 20-Aug-2015 - QUALIFICATION OF NEW LEAD FRAME DESIGN (DIMPLE) IN SELECTED PRODUCTS AVAILABLE IN 8L DFN PACKAGE

• PCN - 05-Nov-2017 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND

• PCN - 02-May-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 30-Apr-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR 8L DFN (2X3X0.9MM) AND 8L DFN-S (6X5X0.9MM) PACKAGES AT NSEB

• PCN - 28-Feb-2015 - QUALIFICATION OF G700LTD MOLDING COMPOUND AND 8600 DIE ATTACH EPOXY FOR SELECTED PACKAGES

• PCN - 01-Jan-2018 - PRODUCT CHANGE NOTI CATION - KSRA-20OSOQ751

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 24-May-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND

• PCN - 10-Feb-2021 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS AVAILABLE 8L DFN PACKAGES

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 30-Jun-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR 8L DFN (2X3X0.9MM) AND 8L DFN-S (6X5X0.9MM) PACKAGES

• PCN - 23-Aug-2018 - DATA SHEET - MCP9808 0.5C MAXIMUM ACCURACY DIGITAL TEMPERATURE SENSOR

• PCN - 30-Nov-2017 - REISSUED INITIAL NOTIFICATION TO INCLUDE CCB 3073

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 28-Feb-2015 - QUALIFICATION OF G700LTD MOLDING COMPOUND AND 8600 DIE ATTACH EPOXY FOR SELECTED PACKAGES

• PCN - 19-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND IN SELECTED PRODUCTS

• PCN - 20-Aug-2015 - QUALIFICATION OF NEW LEAD FRAME DESIGN (DIMPLE) IN SELECTED PRODUCTS AVAILABLE IN 8L DFN PACKAGE

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 09-Nov-2015 - QUALIFICATION OF NEW LEAD FRAME DESIGN (DIMPLE) IN SELECTED PRODUCTS AVAILABLE IN 8L DFN PACKAGE

• PCN - 09-Nov-2015 - QUALIFICATION OF NEW LEAD FRAME DESIGN (DIMPLE) IN SELECTED PRODUCTS AVAILABLE IN 8L DFN PACKAGE

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 30-Jun-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR 8L DFN (2X3X0.9MM) AND 8L DFN-S (6X5X0.9MM) PACKAGES

• PCN - 19-Mar-2018 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND IN SELECTED PRODUCTS

• PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 28-Feb-2015 - QUALIFICATION OF G700LTD MOLDING COMPOUND AND 8600 DIE ATTACH EPOXY FOR SELECTED PACKAGES

• PCN - 02-May-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 30-Apr-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR 8L DFN (2X3X0.9MM) AND 8L DFN S (6X5X0.9MM) PACKAGES AT NSEB

• PCN - 01-Jan-2018 - PRODUCT CHANGE NOTI CATION - KSRA-20OSOQ751

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• Product Change Notification