MCP23S08-E/ML

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• 電子工程工具箱
  

• 数据表

• PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 29-Mar-2019 - DATA SHEET - MCP23008/MCP23S08 DATA SHEET

• PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X

• PCN - 22-Feb-2011 - CCB 1029.02: QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)

• PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

• PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (

• PCN - 06-Jul-2022 - MCP23008/MCP23S08 8-BIT I/O EXPANDER WITH SERIAL INTERFACE REVISION

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 10-Jun-2011 - QUALIFICATION OF 16 & 20L QFN (4X4) PACKAGES WITH EFTEC-64T LEADFRAME AT NSEB (UTL)

• PCN - 11-Nov-2004 -

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 10-Jun-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 31-Aug-2017 - FINAL NOTICE QUALIFICATION OF CUPDAU BOND WIRE AND C194 LEAD FRAME MATERIAL

• PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 22-Feb-2011 - Microchip is announcing the qualification of 16 & 20L QFN (4x4) packages with EFTEC-64T leadframe at

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

• PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 08-Mar-2007 -

• PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

• PCN - 30-May-2011 - Ccb 1029.02: Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

• PCN - 30-Jun-2011 - Qualification Of 16 & 20L Qfn (4X4) Packages With Eftec-64T Leadframe At Nseb (Utl)

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 08-Mar-2007 - Product Change Notice