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375424B00034G by boyd laconia llc
Image is representational - see mfr. specs

375424B00034G

Boyd Laconia LLC

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

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产品说明书 附件 Notify Me

符合 RoHS 规定
Bulk 包装
Certificate of Compliance Guarantee
描述 +
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
规格 +
  • Product Attribute
    Attribute Value Select Attribute
  • 供应商:
    Boyd Laconia LLC
  • 部件编号:
    375424B00034G
  • Alias/AKA:
    042987
  • 计量单位:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • 供应商标准包装: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
Tools/3D Models +
产品指南 +
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
有存货: 3,654
可立即发货
Minimum Order Quantity:
25
6 Weeks 可以发货 7/6/26
添加到购物车
PRICE (USD)
数量
Unit Price
25
$1.148
250
$0.861
500
$0.818
1,000
$0.810
3,360
$0.808
6,720
$0.806
10,080
$0.804
16,800 +
$0.802
Suppliers Standard Package
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