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375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
产品说明书 附件 Notify Me
符合 RoHS 规定
Bulk 包装
Certificate of Compliance Guarantee
描述
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
规格
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Product AttributeAttribute Value Select Attribute
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供应商:Boyd Laconia LLC
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部件编号:375324B00035G
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Alias/AKA:035731
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计量单位:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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供应商标准包装:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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产品指南
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产品说明书
Price Match Guarantee
We�ll meet or beat any authorized competitor�s published price for this part.
有存货:
3,316
可立即发货
库存数量的起订量:
5
缺货数量的起订量:
480
9 Weeks
可以发货
8/3/26
PRICE (USD)
数量
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
Click for Quote
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