Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
Trans IGBT Chip N-CH 700V 1A 2500mW 3-Pin(2+Tab) DPAK T/R
Trans IGBT Module N-CH 600V 100A 329000mW
PIM Q1 3 CHANNEL IGBT+SIC BOOST 240A 1200V PRESS-FIT PINS
Si/SiC Hybrid Modules, 3 Channel Symmetric Boost 1000 V, 150 A IGBT, 1200 V, 30 A SiC Diode Press-fit pins
Trans IGBT Module N-CH 1200V 64A 284000mW
MASS MARKET GEN3 Q2BOOST
Power Integrated Module, Dual Boost, 1200 V, 50 A IGBT + 1200 V, 20 A SiC Diode. Solder pins
IGBT Module, H6.5 Topology, 650 V, 50 A IGBT, 650 V, 50 A Diode Solder pins
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