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PIC18F4420-I/PT by microchip technology

Görsel temsilidir - üretici teknik özelliklerine bakın

PIC18F4420-I/PT

Microchip Technology

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 44 - Package type: TQFP 44 – S ...

Veri Sayfası Donatılar Bana Bildir

RoHS Compliant

TRAY Ambalaj

Uygunluk Sertifikası Garantisi

This product may require extra documentation. Shipping may be delayed 1-2 days.

tanım +

PIC 18 microcontroller - MCU 8 bit - RISC architecture - 75 Instructions - 2 V to 5.5 V - Pins: 44 - Package type: TQFP 44 – Speed 40 MHz - Flash 16 KB – SRAM 768 Bytes – EEPROM 256 Bytes - I/O: 36 – A/D: 10 bit with 13 channels – 04 Timers – MSSP – CCP –

Search Keywords: PIC18F4420IPT

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Bulunan ürünler: 0 Show Similar
satıcı:

Microchip Technology
Parça Numarası:

PIC18F4420-I/PT
Ölçü Birimi:

Başına Each
RoHS :

Yes
HTS:

8542310015
COO:

TH
ECCN:

3A991.a.2
Supplier Standard Pack:

160
Program Bellek Boyutu:

16 KB
RAM Boyutu:

768 B
Çalışma Sıcaklığı:

-40 to 85 °C
ADC Çözünürlüğü:

10 bit
Programlanabilir I/O Sayısı:

34
Program Belleği Tipi:

Flash

Araçlar/3D Modeller +

EE ARAÇ KUTUSU

kaynaklar +

Veri Sayfası

Learn more about Microchip Technology Top Selling Microcontrollers and Microprocessors

Product Changes +

PCN - 07-Jun-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 24-Jan-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 44L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 06-Mar-2006 - Product Change Notice

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 01-Dec-2005 - Product Change Notice

PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

PCN - 11-Nov-2004 - Product Change Notice

PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 01-Dec-2005 - 44L PLCC PB-FREE PACKAGE QUALIFICATION AT MMS (ATES)

PCN - 08-Mar-2007 - Product Change Notice

PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB

PCN - 22-May-2013 - Microchip is announcing the qualification of the listed 44L TQFP package products with palladium coa

Product Change Notification

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. Alternatife Bak
Different product options available. Alternatife Bak
Different packageing options available. Alternatife Bak
Possible Replacement options available. Alternatife Bak
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

Stokta: 480

Gönderim today, if you order in

Manufacturer Stock:

6.450 Gemi olabilir 7.27.26

Minimum Order Quantity:

5

FABRİKA KURŞUN-ZAMAN:

11 Weeks Gemi olabilir 9.28.26

Fiyat (USD)

MİKTAR

Birim Fiyat

5

$6.58

25

$6.04

50

$6.03

160

$5.73

320

$5.44

640

$5.43

1.120

$5.42

2.560 +

$5.31

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