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375324B00035G

Boyd Laconia LLC

Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized

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RoHS Compliant
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
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  • Product Attribute
    Attribute Value Select Attribute
  • satıcı:
    Boyd Laconia LLC
  • Parça Numarası:
    375324B00035G
  • Alias/AKA:
    035731
  • Ölçü Birimi:
    Per Each
  • RoHS :
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    10.2 x 10.2 x 10.26714mm
  • Thermal Resistance:
    71.46717°C/W
  • Finish:
    Black Anodized6710
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We’ll meet or beat any authorized competitor’s published price for this part.
Stokta: 3.316
Hemen gönderilebilir
Stoktaki Miktar için Minimum Sipariş Miktarı:
5
Stokta Olmayan Miktar için Minimum Sipariş Miktarı:
480
9 Weeks Gemi olabilir 7.6.26
Sepete ekle
PRICE (USD)
MİKTAR
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1.440
$3.988
1.920 +
$3.960
Click for Quote
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Tariffs may apply for U.S. shipments
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