1542005-3 TE Connectivity / AMP Brand | Heat Sinks
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1542005-3 by TE Connectivity / AMP Brand
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1542005-3

TE Connectivity / AMP Brand

Heat Sink Passive BGA Pin Array Clip Aluminum 11.21 C/W Black Anodized

PRICING per each  AVAILABILITY Updated Today   
1-4 :$59.13
5-9 :$57.97
10 + :$56.83
143 can ship tomorrow
In our stock This is the quantity we have on-hand in our inventory for immediate shipment.
RESOURCES
SPECS
Supplier: TE Connectivity / AMP Brand
Part No: 1542005-3
RoHS: Yes
Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. <b>Minimum Order Quantities</b> and <b>Required Order Multiples</b> are presented with our price and availability information. 50
Type: Passive
Family: 1542005
Device Cooled: BGA
Attachment Method: Adhesive
Thermal Resistance: 11.21 °C/W
Mounting: Clip
Finish: Black Anodized
Fin Style: Pin Array
Dimension: 19.05 x 34.95 mm
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DESCRIPTION
Heat Sink Passive BGA Pin Array Clip Aluminum 11.21 C/W Black Anodized

Product Highlights
  • Heat Sink
  • BGA
  • Package Size = 21 [.827] mm [in]
  • For Use With BGA Semiconductor Packages
  • Power Air Velocity Thermal Resistance

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Thermal Solutions, CoolSnap, Cool Link,
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PART CLASSIFICATION DATA
HTS: 8414596095
COO: US
ECCN: EAR99