24LC64F-I/SN

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• НАБОР ИНСТРУМЕНТОВ ЭЭ
  

• PCN - 22-Mar-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

• PCN - 26-Apr-2012 - 24AA64F/24LC64F/24FC64F 64K I2C SERIAL EEPROM WITH QUARTER-ARRAY WRITE-PROTECT DATA SHEET DOCUMENT

• PCN - 01-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

• PCN - 16-Feb-2022 - MANUFACTURING CHANGE

• PCN - 12-Jan-2012 - Microchip has released a new devicedoc for the listed 24AA64/24LC64/24FC64 data sheet of devices in

• PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 19-Apr-2010 - QUALIFICATION OF 8L DFN (4X4) PACKAGE WITH CRM1076DJ DIE ATTACH AND G770HCD MOLD COMPOUND

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 18-Mar-2022 - MICROCHIP HAS RELEASED NEW PRODUCT DOCUMENTS FOR THE 24AA64/24FC64/24LC64 64-KBIT I2C SERIAL EEPROM

• PCN - 26-Apr-2012 - Microchip has released a new devicedoc for the 24AA64F/24LC64F/24FC64F 64K I2C serial EEPROM with qu

• PCN - 07-Apr-2022 - MANUFACTURING CHANGE

• PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 29-Mar-2010 - DATA SHEET-24AA64/24LC64/24FC64 DATA SHEET

• PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

• PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 10-Dec-2012 - 24AA64/24LC64/24FC64 DATA SHEET

• PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

• PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 19-Apr-2010 - Microchip is announcing the Qualification of 8L DFN (4x4) package with CRM1076DJ die attach and G770

• PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 08-Nov-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

• PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

• PCN - 30-Nov-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

• PCN - 29-Mar-2010 - Microchip has released a new DeviceDoc for the 24AA64/24LC64/24FC64 Data Sheet of devices.

• PCN - 23-Sep-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 12-Jan-2012 - DATA SHEET-24AA64/24LC64/24FC64 DATA SHEET DATA SHEET DOCUMENT REVISION

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 01-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 13-Jan-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

• PCN - 19-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 10-Dec-2012 - DATA SHEET - 24AA64/24LC64/24FC64 DATA SHEET

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 22-Sep-2011 - QUALIFICATION OF 8L SOIC WITH SG-8300GM MC AT ALPH (MMT) ASSEMBLY SITE

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 09-Apr-2022 - PCN TO UPDATE THE AFFECTED CPN LIST BY REMOVING 24FC64F, 24LC64F, 24AA64F PRODUCTS

• PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 28-Apr-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP