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Image is representational - see mfr. specs
375424B00034G
Boyd Laconia LLC
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Технический паспорт АКСЕССУАРЫ Notify Me
RoHS Compliant
Bulk Упаковка
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Описание
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
спецификация
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Product AttributeAttribute Value Select Attribute
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поставщик:Boyd Laconia LLC
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Артикул / №:375424B00034G
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Alias/AKA:042987
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Единица измерения:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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НАБОР ИНСТРУМЕНТОВ ЭЭ
ресурсы
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Технический паспорт
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
на складе:
3,654
Возможна немедленная отправка
Minimum Order Quantity:
25
6 Weeks
Можно отправить
3/7/26
PRICE (USD)
КОЛ-ВО
Unit Price
25
$1.148
250
$0.861
500
$0.818
1 000
$0.810
3 360
$0.808
6 720
$0.806
10 080
$0.804
16 800 +
$0.802
Click for Quote
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