MCP23017-E/ML

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• НАБОР ИНСТРУМЕНТОВ ЭЭ
  

• Техническое описание

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 16-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 150K AND 160 TECHNOLOGY

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of 28L QFN (6x6) package at ASAC (UTAC) assembly site in o

• PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE

• PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X

• PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

• PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a

• PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

• PCN - 24-May-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

• PCN - 10-Sep-2008 - QUALIFICATION OF 28L QFN (6X6X0.9MM) PACKAGE AT ASAT LIMITED, CHINA (ASAC) ASSEMBLY

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

• PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 22-Jul-2008 - Microchip is announcing the qualification of UTAC THAI LIMITED (UTL) as a new test site for 28QFN (6

• PCN - 20-Apr-2011 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE

• PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

• PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION

• PCN - 01-Jul-2022 - DOCUMENT CHANGE

• PCN - 27-Mar-2009 - Microchip is cancelling the previously announced CCB#848 as the current production demand for 28L QF

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 22-Jul-2008 - QUALIFICATION OF UTAC THAI LIMITED (UTL) TO TEST 28QFN (6X6) PACKAGED PRODUCTS

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 21-Jul-2008 - Microchip is announcing the qualification of 28L QFN package (6X6X0.9mm) at ATP Assembly in order to

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 21-Jul-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9 MM) AT ATP ASSEMBLY

• PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

• PCN - 11-Nov-2004 -

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 10-Sep-2008 - Microchip is announcing the qualification of new assembly site for 28L QFN (6X6X0.9MM) package dsPIC

• PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY

• PCN - 27-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGY

• PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

• PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 26-Apr-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 08-Nov-2010 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE.

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

• PCN - 08-Mar-2007 -

• PCN - 10-Sep-2008 - NEW ASSEMBLY SITE

• PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

• PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

• PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 27-Mar-2009 - PCN CCB#848 CANCELLED

• PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo

• PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

• PCN - 27-Oct-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9MM) AT ATP ASSEMBLY

• PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (

• PCN - 24-Nov-2008 - Qualification Of 28L Qfn Package (6X6X0.9Mm) At Atp Assembly

• PCN - 01-Sep-2008 - Qualification Of 28L Qfn Package (6X6X0.9 Mm) At Atp Assembly

• PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 30-Jan-2011 - Qualification Of 28L Qfn (6X6) Package At Asac (Utac) Assembly Site.

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 31-Oct-2008 - Qualification Of 28L Qfn (6X6X0.9Mm) Package At Asat Limited, China (Asac) Assembly

• PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 30-Sep-2008 - Qualification Of Utac Thai Limited (Utl) To Test 28Qfn (6X6) Packaged Products

• Product Change Notification