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MCP23S17-E/ML

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MCP23S17T-E/ML

Microchip Technology

In Stock: 15,850

Minimum Order: 250

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microchip technology
Authorized Distributor

Microchip Technology Authorized Distributor

MCP23S17-E/ML

Name: MCP23S17-E/ML Microchip Technology IO Expanders
Brand: Microchip Technology
SKU: 44930537
Availability: BackOrder

16-Bit I/O Expander - 10MHz - SPI - 5.5 V - QFN - 28-Pin.

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RoHS Compliant

TUBE Packaging

Certificate of Compliance

Description +

16-Bit I/O Expander - 10MHz - SPI - 5.5 V - QFN - 28-Pin.

Product Highlights:

Potential Applications:

Search Keywords: MCP23S17EML

SPECS +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
Supplier:

Microchip Technology
Part No:

MCP23S17-E/ML
Unit of Measure:

Per Each
RoHS:

Yes
HTS:

8542390090
COO:

MY
ECCN:

EAR99
Supplier Standard Pack:

61
Maximum Operating Supply Voltage:

5.5 V
Dimension:

6 x 6 x 0.88 mm
Family:

MCP23S17
Interrupt Output:

Yes
I2C Bus Interface Mode:

Standard Mode
Manual Reset:

Yes
Interface Speed:

10000 kHz
Interface Type:

SPI

Symbol, Footprint, 3D Model

Tools/3D Models +

EE ToolBox

Product Guides +

Datasheet

Product Changes +

PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 27-Oct-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9MM) AT ATP ASSEMBLY

PCN - 01-Jul-2022 - DOCUMENT CHANGE

PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY

PCN - 20-Apr-2011 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE

PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE

PCN - 27-Mar-2009 - PCN CCB#848 CANCELLED

PCN - 27-Mar-2009 - Microchip is cancelling the previously announced CCB#848 as the current production demand for 28L QF

PCN - 22-Jul-2008 - Microchip is announcing the qualification of UTAC THAI LIMITED (UTL) as a new test site for 28QFN (6

PCN - 06-Feb-2008 - Qualification of CRM1706DJ die attach EPOXY and G770HCD mold compound for 20L QFN (4X4), 28L QFN (6X

PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

PCN - 08-Nov-2010 - QUALIFICATION OF 28L QFN (6X6) PACKAGE AT ASAC (UTAC) ASSEMBLY SITE.

PCN - 08-Mar-2007 -

PCN - 16-Feb-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

PCN - 09-Jan-2014 - Microchip is announcing the qualification the listed products with palladium coated copper (PdCu) bo

PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

PCN - 26-Apr-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 20-Jul-2015 - QUALIFICATION OF G700LTD MOLD COMPOUND AND 8600 DIE ATTACH IN VARIOUS QFN PACKAGES

PCN - 25-Nov-2016 - QUALIFICATION OF CUPDAU WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGIES AVAILABLE

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 16-Aug-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

PCN - 26-Dec-2013 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION

PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

PCN - 22-Jul-2008 - QUALIFICATION OF UTAC THAI LIMITED (UTL) TO TEST 28QFN (6X6) PACKAGED PRODUCTS

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

PCN - 27-Feb-2018 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS OF THE 150K AND 160K WAFER TECHNOLOGY

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

PCN - 10-Sep-2008 - NEW ASSEMBLY SITE

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 16-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 150K AND 160 TECHNOLOGY

PCN - 10-Sep-2008 - QUALIFICATION OF 28L QFN (6X6X0.9MM) PACKAGE AT ASAT LIMITED, CHINA (ASAC) ASSEMBLY

PCN - 24-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE FOR SELECTED PRODUCTS OF 150K AND 160K WAFER TECHNOLOGY

PCN - 21-Oct-2016 - QUALIFICATION OF CUPDAU BOND WIRE IN 150K WAFER TECHNOLOGY AVAILABLE IN 28L QFN PACKAGE

PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

PCN - 08-Nov-2010 - Microchip is announcing the qualification of 28L QFN (6x6) package at ASAC (UTAC) assembly site in o

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 21-Jul-2008 - Microchip is announcing the qualification of 28L QFN package (6X6X0.9mm) at ATP Assembly in order to

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

PCN - 28-Jan-2014 - QUALIFICATION OF 28L QFN, 20L QFN AND 16L QFN PACKAGES AT MTAI ASSEMBLY SITE

PCN - 26-Dec-2013 - Microchip is announcing the qualification of the listed 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

PCN - 10-Sep-2008 - Microchip is announcing the qualification of new assembly site for 28L QFN (6X6X0.9MM) package dsPIC

PCN - 01-Apr-2014 - QUALIFICATION OF SELECTED PRODUCTS IN 28L QFN, 20L QFN & 16L QFN WITH PDCU BOND WIRE AT MTAI SITE

PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

PCN - 25-Jun-2015 - CANCELLATION NOTICE: QUALIFICATION OF SELECTED PRODUCTS WITH PDCU BOND WIRE AT MTAI SITE

PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 11-Nov-2004 -

PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

PCN - 20-Jul-2015 - QUALIFICATION OF C194 LEAD-FRAME FOR SELECTED QFN AND UQFN PACKAGES AT NSEB ASSEMBLY SITE

PCN - 24-May-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 21-Jul-2008 - QUALIFICATION OF 28L QFN PACKAGE (6X6X0.9 MM) AT ATP ASSEMBLY

PCN - 28-Jan-2014 - Microchip is announcing the qualification of 28L QFN (6x6x0.9mm and 5x5x0.9mm), 20L QFN (5x5x0.9mm a

PCN - 12-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

PCN - 01-Feb-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS

PCN - 01-Sep-2008 - Qualification Of 28L Qfn Package (6X6X0.9 Mm) At Atp Assembly

PCN - 08-Mar-2007 - Product Change Notice

PCN - 30-Jan-2011 - Qualification Of 28L Qfn (6X6) Package At Asac (Utac) Assembly Site.

PCN - 31-Oct-2008 - Qualification Of 28L Qfn (6X6X0.9Mm) Package At Asat Limited, China (Asac) Assembly

PCN - 30-Sep-2008 - Qualification Of Utac Thai Limited (Utl) To Test 28Qfn (6X6) Packaged Products

PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

PCN - 11-Nov-2004 - Product Change Notice

PCN - 24-Nov-2008 - Qualification Of 28L Qfn Package (6X6X0.9Mm) At Atp Assembly

PCN - 21-Feb-2014 - Qualification Of 28L Qfn, 20L Qfn And 16L Qfn Packages At Mtai Assembly Site

PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

Frequently Asked Questions

Is MCP23S17-E/ML RoHS compliant?

Yes, MCP23S17-E/ML is RoHS compliant.

What is the lead time for MCP23S17-E/ML?

The standard lead time for MCP23S17-E/ML is approximately 17 days. In-stock quantities ship from OnlineComponents.com.

Price Match Guarantee - we'll meet or beat any authorized Competitor's published price.

Price Match

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. See alternative
Different product options available. See alternative
Different packaging options available. See alternative
Possible Replacement options available. See alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

This product is no longer being manufactured but there may be alternatives. We can help you, Contact Us.

Price Match Guarantee

We’ll meet or beat any authorized competitor’s published price for this part.

In Stock: 0

On Order:

1,037 can ship 10/12/26

Manufacturer Stock:

0 can ship

Stock lot only:

Minimum Order Quantity:

MOQ for out of Stock Qty:

Order Increment:

Factory Lead-Time:

17 Weeks can ship 12/14/26

ADD TO CART

Your order may include a combination of full reels and cut tape depending on available stock.

Full Reels Only – Selecting this will hold your order for full reel fulfillment. Cut tape will not be substituted.

Price (USD)

A tariff of {0} may be applied if shipping to the United States.

Qty

Unit Price

$2.03

305

$2.00

549

$1.99

1,037

$1.98

2,501

$1.97

5,002

$1.96

7,503

$1.95

10,004 +

$1.94

Supplier's Standard Package

Standard Packaging

Standard packaging is the minimum package size OnlineComponents.com receives from the supplier. The minimum order quantity might be less than the supplier's standard packaging. The type of packaging (such as reel, tube, tray) may be subject to change when the product is divided into smaller quantities.

Reel Packaging

This product ships on a reel. Depending on the quantity ordered, you may receive full factory reels, cut tape (components on a strip cut from a reel), or a combination of both.

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