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375424B00034G by boyd laconia llc
Image is representational - see manufacturer specifications

Boyd Laconia LLC Authorized Distributor

375424B00034G

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description +
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    375424B00034G
  • Alias/AKA:
    042987
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
Symbol, Footprint, 3D Model
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Frequently Asked Questions
Is 375424B00034G RoHS compliant?
Yes, 375424B00034G is RoHS compliant.
What is the lead time for 375424B00034G?
The standard lead time for 375424B00034G is approximately 6 weeks. In-stock quantities ship from OnlineComponents.com.
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 3,512
Ships today, if you order in
MOQ for In Stock Qty:
25
MOQ for out of Stock Qty:
840
6 Weeks can ship 11/6/26
ADD TO CART
Price (USD)
Qty
Unit Price
25
$1.093
250
$0.861
500
$0.818
840
$0.810
1,680
$0.808
2,520
$0.806
3,360 +
$0.804
Supplier's Standard Package
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