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375424B00034G by boyd laconia llc
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375424B00034G

Boyd Laconia LLC

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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  • Product Attribute
    Attribute Value Select Attribute
  • 공급자:
    Boyd Laconia LLC
  • 부품 번호:
    375424B00034G
  • Alias/AKA:
    042987
  • 측정 단위:
    Per Each
  • 유해물질 제한지침(RoHS):
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • 공급자 표준 포장: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
재고 보유: 3,694
Ships today, if you order in
Minimum Order Quantity:
25
6 Weeks 배송 가능 7. 2. 26
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PRICE (USD)
수량
Unit Price
25
$1.148
250
$0.861
500
$0.818
1,000
$0.810
3,360
$0.808
6,720
$0.806
10,080
$0.804
16,800 +
$0.802
Suppliers Standard Package
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