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375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
데이터 시트 액세서리 Notify Me
유해물질 제한지침(RoHS) 준수
Bulk 포장
Certificate of Compliance Guarantee
설명
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
사양
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Product AttributeAttribute Value Select Attribute
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공급자:Boyd Laconia LLC
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부품 번호:375324B00035G
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Alias/AKA:035731
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측정 단위:Per Each
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유해물질 제한지침(RoHS):Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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공급자 표준 포장:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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자료
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데이터 시트
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
재고 보유:
3,316
즉시 배송 가능
재고 수량을 위한 MOQ:
5
품절 수량을 위한 MOQ:
480
9 Weeks
배송 가능
7. 27. 26
PRICE (USD)
수량
Unit Price
5
$7.401
100
$4.615
250
$4.365
480
$4.175
960
$4.067
1,440
$3.988
1,920 +
$3.960
Click for Quote
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