767094-5

TE Connectivity / AMP Brand

MICT,RECPT,190,ASY,PDNI,EXTD

+ see all

データシートアクセサリー Notify Me

RoHS非遵守

Tube 包装

Certificate of Compliance Guarantee

説明 +

MICT,RECPT,190,ASY,PDNI,EXTD

Product Highlights:

Connector
Connector Type = Receptacle
Mated Stack Height (Vertical) = 15.62 mm, 18.00 mm, 20.00 mm, 21.60 mm, 27.00 mm, 27.80 mm, 29.00 mm, 31.90 mm
190 Positions
Vertical Mount Angle

Potential Applications:

Search Keywords: 7670945

仕様 +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
サプライヤー:

TE Connectivity / AMP Brand
部品番号:

767094-5
測定単位:

Per Each
RoHS:

No
HTS:

8536694040
COO:

US
ECCN:

EAR99
サプライヤー標準パック:

7
Housing Material:

Liquid crystal polymer(LCP)
Rectangular Termination Post & Tail Thickness:

.008 in, .2 mm
Insulation Resistance:

2 MΩ
Connector Length:

3 in, 76.2 mm
UL Rating:

Listed
Circuit Application:

Signal
Packaging Quantity:

7
Connector & Contact Terminates To:

Printed Circuit Board
Termination Method to Printed Circuit Board:

Surface Mount
Impedance:

50 Ω
Contact Mating Area Plating Material Thickness:

5 µin, .12 µm
Contact Base Material:

Copper Alloy
Contact Type:

Socket
Mating Alignment:

Without
Rectangular Termination Post & Tail Width:

.021 in, .53 mm
PCB Mount Retention:

With
Sealable:

No
Stack Height:

1.255 in, 15.62 mm, 18 mm, 20 mm, 21.6 mm, 27 mm, 27.8 mm, 29 mm, 31.9 mm
Contact Layout:

Inline
Differential Signaling:

Yes
PCB Mount Alignment Type:

Locating Posts
PCB Connector Assembly Type:

PCB Mount Receptacle
Connector Width:

.315 in, 8 mm
UL Flammability Rating:

UL 94V-0
Operating Voltage:

5 VDC
Operating Temperature Range:

-55 – 125 °C, -67 – 257 °F
Number of Power Positions:

5
Connector Mounting Type:

Board Mount
PCB Mount Alignment:

With
Contact Current Rating (Max):

11.5 A
Number of Signal Positions:

190
Number of Positions:

190
PCB Contact Termination Area Plating Material:

Tin-Lead
Centerline (Pitch):

.025 in, .64 mm
Mating Entry Location:

Bottom
PCB Mount Orientation:

Vertical
Number of Columns:

95
Contact Shape & Form:

Dual Beam
Mating Retention:

With
Data Rate:

10 Gb/s
Board-to-Board Configuration:

Parallel
PCB Thickness (Recommended):

.8 in, 1.57 mm
Connector System:

Board-to-Board
Approved Standards:

CSA 1195944 , UL E28476
Contact Mating Area Plating Material:

Gold Flash over Palladium Nickel
Connector Height:

.591 in, 15.01 mm
Contact Underplating Material:

Nickel
Header Type:

Fully Shrouded
Primary Product Color:

Black
Packaging Type:

Box , Tube
Agency/Standard:

CSA , UL