PIC18F1320-I/SS

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• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 28-Aug-2009 - MPLAB C for PIC18 MCU's v3.33 has been released to the web and is available for download.This releas

• PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

• PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

• PCN - 19-May-2009 - MPLAB C COMPILER FOR PIC18 MCUS V3.31 RELEASED

• PCN - 07-Oct-2005 - Product Change Notice

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 06-Mar-2006 - Product Change Notice

• PCN - 05-Mar-2010 - MPLAB C FOR PIC28 V3.35 RELEASED

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

• PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

• PCN - 01-Jan-2006 - 20L Ssop 207'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

• PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 19-May-2009 - Microchip is releasing the MPLAB C Compiler for PIC18 MCUs v3.31 which will provide new part support

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

• PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300

• PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 12-Mar-2003 - FIRMWARE CHANGE

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

• PCN - 14-Jul-2009 - MPLAB C COMPILER FOR PIC18 MCU'S VERSION 3.32 IS RELEASED

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded