PIC16C558-04/P

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• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

• PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 23-Dec-2011 - Qualification Of 18L Pdip At Alph (Mmt) Assembly Site

• PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT

• PCN - 20-Jan-2012 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) for the listed products in order

• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

• PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 05-Sep-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY FOR 18L AND 20L PDIP PACKAGES

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 06-Mar-2006 - Product Change Notice

• PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

• PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

• PCN - 01-Jan-2006 - 18L Soic 300'' Package Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 15-Mar-2001 - Mtai Change; 18-Lead Pdip (/P) Package Paddle Size From 140X160 Mil To 160X250 For The Picmicro/Sdp

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 27-Jan-2012 - Ccb 1090 Final Notification: Qualification Of 18L Pdip At Alph (Mmt)

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

• PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH

• PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

• PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 05-Aug-2008 - Microchip is changing the bill of material i.e mold Compound and Die attach epoxy in order to improv

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 18L PDIP at ALPH (MMT) assembly site for the listed pro

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ