MCP6022T-E/ST

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• PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 22-Jan-2004 - Product Change Notice

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag

• PCN - 20-Jun-2012 - Qualification Of 8L Tssop Package At Mmt (Alph) Assembly Site

• PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 25-Oct-2004 - Change From Snpb Plating To Matte Tin Plating (Industry-Standard Pure Sn) Of The Device Leads

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE

• PCN - 01-Feb-2006 - Product Change Notice

• PCN - 19-Mar-2007 - Product Change Notice

• PCN - 01-Sep-2004 - ADD MICROCHIP THAILAND AS A QUALIFIED PROBE MANUFACTURING SITE

• PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea

• PCN - 13-Jul-2006 - Product Change Notice

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 31-May-2007 - Qualification At New Assembly Plant Nse2 (Ns Electronics, Bangkok)

• PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

• PCN - 01-Jun-2012 - Qualification Of 8L Tssop Package At Mmt (Alph) Assembly Site

• PCN - 03-Jun-2004 - Product Change Notice