help desk software

首页 ›
所有产品›
集成电路 - IC ›
电源管理 ›
稳压器 - 线性稳压器 ›
MCP1703T-3302E/DB

可用替代品

Embalaje alternativo

MCP1703-3302E/DB Microchip Technology

MCP1703-3302E/DB

Microchip Technology

有存货: 1,248

起订量: 78

查看产品

数量框中只允许输入数字字符。请检查您的输入，然后再次点击添加到购物车。

MCP1703T-3302E/DB by microchip technology

图片仅供参考 - 请查看制造商规格

microchip technology
授权经销商

Microchip Technology 授权经销商

MCP1703T-3302E/DB

Name: MCP1703T-3302E/DB Microchip Technology Voltage Regulators Linear
Brand: Microchip Technology
SKU: 44806530
Availability: InStock

Fixed LDO Voltage Regulator - 2.7 V to 16 V in - 525 mV Dropout - 3.3 V out - 250 mA out - SOT-223-3 - 4-Pin(3+Tab).

+ 查看全部

查看数据表询问数据表附件到货时通知我

数据表助手

回答仅限于此零件。请对照数据表核实关键规格。

符合 RoHS

REEL 包装

合规证书

描述 +

Fixed LDO Voltage Regulator - 2.7 V to 16 V in - 525 mV Dropout - 3.3 V out - 250 mA out - SOT-223-3 - 4-Pin(3+Tab).

产品亮点:

潜在应用:

搜索关键词: MCP1703T3302EDB

规格 +

产品属性

属性值选择属性
找到的产品: 0 显示相似项
供应商:

Microchip Technology
部件编号:

MCP1703T-3302E/DB
计量单位:

每件
RoHS:

是
HTS:

8542390090
COO:

TW
ECCN:

EAR99
卷盘包装:

4000
结到环境热阻:

62(Typ) °C/W
精度:

±2 %
结到外壳热阻:

15(Typ) °C/W
功能:

LDO
负载调整率:

1(Typ) %
电源调整率:

0.1(Typ) %/V
最大压差电压 @ 电流:

0.725@250mA V
尺寸:

6.5 x 3.5 x 1.6 mm
系列:

MCP1703

符号、封装和 3D 模型

工具/3D模型 +

電子工程工具箱

产品指南 +

数据表

产品更改 +

PCN - 31-Oct-2012 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 28-Feb-2013 - Microchip is announcing the qualification of 3L SOT-223 with conductive die attach at LPI assembly s

PCN - 25-Feb-2012 - QUALIFICATION OF 3L & 5L SOT-223 AT LPI ASSEMBLY SITE

PCN - 15-Dec-2011 - Microchip is announcing the qualification of 3L and 5L SOT-223 at LPI assembly site for the listed p

PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products

PCN - 18-Oct-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT ATP ASSEMBLY SITE

PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at

PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-23A at LPI assembly site for the listed products

PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a

PCN - 04-Mar-2011 - Data Sheet-Mcp1703 Data Sheet

PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Mcp1703 Data Sheet Of Devices.

PCN - 16-Sep-2009 - Microchip Has Released A New Device Document For The Mcp1703 Datasheet Of Devices.

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 19-May-2011 - Microchip is announcing the qualification of 8L DFN (2x3) packages with EFTEC-64T leadframe at NSEB

PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a

PCN - 20-Nov-2010 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 04-Mar-2011 - Microchip Has Released A New Devicedoc For The Mcp1703 Data Sheet Of Devices.

PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-23A package wit

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 01-Mar-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT LPI ASSEMBLY SITE

PCN - 06-Dec-2013 - FINAL NOTICE: QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT ATP ASSEMBLY SITE

PCN - 11-Jan-2013 - QUALIFICATION OF 3L SOT-223 WITH CONDUCTIVE DIE ATTACH AT LPI ASSEMBLY SITE

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

Product Change Notification

常见问题

MCP1703T-3302E/DB 是否符合 RoHS 标准？

是的，MCP1703T-3302E/DB 符合 RoHS 标准。

MCP1703T-3302E/DB 的交货期是多少？

MCP1703T-3302E/DB 的标准交货期约为 25 周。有库存的数量由 OnlineComponents.com 发货。

价格匹配保证 - 我们将匹配或优于任何授权竞争对手公布的价格。

要求价格匹配

此产品已停产，但仍有库存.
此产品不符合 RoHS 标准. 查看备选方案
提供不同的产品选项. 查看备选方案
提供不同包装选项. 查看备选方案
有可用的可能替代选项. 查看备选方案
商品已停产
税
商品已停产

此产品已不再生产，但可能有替代品。我们可以帮助您, 联络我们.

价格匹配保证

We’ll meet or beat any authorized competitor’s published price for this part.

有存货: 400

可立即发货购买全部 400 个现货或常规最小订购数量 500

已订购:

制造商库存:

0 可以发货

仅库存批次:

400

最小订购数量:

500

缺货数量的起订量:

多个:

工厂交货期:

25 周可以发货 3/23/27

45ドルフラットレート配送:

添加到购物车

根据可用库存，您的订单可能包含整盘和切带的组合。

Backorder Full Reels – Selecting this will hold your order for full reel fulfillment. Cut tape will not be substituted.

价格 (USD)

如果运往美国，可能会征收 {0} 的关税。

数量

单价

$0.7073

500

$0.6430

1,000

$0.6310

4,000

$0.6240

8,000

$0.6230

12,000

$0.6210

16,000

$0.6200

28,000 +

$0.6180

卷盘包装

标准包装

标准包装是 OnlineComponents.com 从供应商处收到的最小包装尺寸。最低订购数量可能小于供应商的标准包装。产品被拆分为较小数量时，包装类型（如卷盘、管装、托盘）可能会发生变化。

卷盘包装

此产品以卷盘发货。根据订购数量，您可能会收到完整的工厂卷盘、裁切编带（从卷盘上裁切下来的条带上的元件）或两者的组合。

点击询价

登录解锁特价

计划订单

您可以在购物车中安排发货数量和发货日期。

Microchip Technology 授权经销商

MCP1703T-3302E/DB

价格 (USD)

标准包装

卷盘包装

加入电路，让您与 OnlineComponents.com 及更多精彩保持连接！