MCP1702T-5002E/CB

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• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 27-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 20-Nov-2010 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE MCP1702 DATA SHEET OF DEVICES

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 04-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 135K DLM

• PCN - 27-Oct-2011 - QUALIFICATION OF 3L SOT-23A AT LPI ASSEMBLY SITE

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 04-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 135K DLM

• PCN - 28-Apr-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 3L SOT-23A PACKAGE AT LPI ASSEMBLY

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 13-Aug-2012 - QUALIFICATION OF 3L SOT-23A PACKAGE WITH SELECTIVE AG PLATING ON THE LEAD-FRAME

• PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-89 package with

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 10-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 3L SOT-23A PACKAGE AT LPI ASSEMBLY SITE

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 23-Nov-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 135K DLM

• PCN - 11-Nov-2004 -

• PCN - 11-Apr-2012 - QUALIFICATION OF 3L SOT-23A PACKAGE WITH SELECTIVE AG PLATING ON THE LEAD-FRAME AT LPI ASSEMBLY SITE

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 14-Jul-2011 - Microchip is announcing the qualification of 3L SOT-89 with Ag platting on the entire lead-frame at

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 23-Nov-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 135K DLM

• PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-89 at LPI assembly site for the listed products

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 3L SOT-89 with full Ag platting on the paddle at HANA a

• PCN - 20-Nov-2010 - Microchip has released a new DeviceDoc for the listed MCP1702 Data Sheet of devices.

• PCN - 27-Oct-2011 - Microchip is announcing the qualification of 3L SOT-23A at LPI assembly site for the listed products

• PCN - 10-Sep-2014 - QUALIFICATION OF C194 LEAD-FRAME IN 3L SOT-23A PACKAGE AT LPI ASSEMBLY SITE

• PCN - 05-Apr-2017 - QUALIFICATION OF JCET AS AN ADDITIONAL ASSEMBLY SITE FOR SELECTED PRODUCTS OF 135K DLM

• PCN - 11-Apr-2012 - Microchip is announcing the qualification of LPI assembly site for the listed 3L SOT-23A package wit

• PCN - 13-Aug-2012 - QUALIFICATION OF 3L SOT-23A PACKAGE WITH SELECTIVE AG PLATING ON THE LEAD-FRAME AT LPI ASSEMBLY SITE

• PCN - 30-Aug-2012 - Qualification Of 3L Sot-23A Package With Selective Ag Plating On The Lead-Frame

• PCN - 15-Nov-2011 - Qualification Of 3L Sot-23A At Lpi Assembly Site

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 30-Jun-2012 - Qualification Of 3L Sot-23A Package With Selective Ag Plating On The Lead-Frame At Lpi Assembly Site

• Product Change Notification