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375424B00034G by boyd laconia llc
Image is representational - see manufacturer specifications

Boyd Laconia LLC Authorized Distributor

375424B00034G

The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.

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RoHS Compliant
Bulk Packaging
Certificate of Compliance
Description +
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
SPECS +
  • Product Attribute
    Attribute Value Select Attribute
  • Supplier:
    Boyd Laconia LLC
  • Part No:
    375424B00034G
  • Alias/AKA:
    042987
  • Unit of Measure:
    Per Each
  • RoHS:
    Yes
  • HTS:
    8542900000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier's Standard Package: The item count, length, weight, or volume contained in the supplier’s original packaging for efficient storage, handling, and distribution.
    3360
  • Device Cooled:
    BGA6707,FPGA6707
  • Attachment Method:
    Tape6706
  • Dimension:
    15.2 x 15.2 x 6.356714mm
  • Thermal Resistance:
    62.56717°C/W
  • Finish:
    Black Anodized6710
Symbol, Footprint, 3D Model
Tools/3D Models +
Product Guides +
Frequently Asked Questions
Is 375424B00034G RoHS compliant?
Yes, 375424B00034G is RoHS compliant.
What is the lead time for 375424B00034G?
The standard lead time for 375424B00034G is approximately 6 weeks. In-stock quantities ship from OnlineComponents.com.
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
In Stock: 3,512
Can Ship immediately
MOQ for In Stock Qty:
25
MOQ for out of Stock Qty:
840
6 Weeks can ship 11/30/26
45ドルフラットレート配送:
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Price (USD)
Qty
Unit Price
25
$1.273
250
$0.861
500
$0.818
840
$0.810
1,680
$0.808
2,520
$0.806
3,360 +
$0.804
Supplier's Standard Package
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