PIC32MX360F512L-80I/PT

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• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 20-Dec-2010 - Microchip Has Released A New Devicedoc For The Pic32Mx3Xx/4Xx Family

• PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

• PCN - 13-Apr-2012 - Qualification Of Ypaa And Tdaa Masks Without Polyimide Process

• PCN - 05-Apr-2012 - Pic32Mx3Xx/4Xx Family Silicon Errata And Data Sheet Clarification Errata Document Revision

• PCN - 22-Mar-2011 - A New Devicedoc For Pic32Mx3Xx/4Xx Family Silicon Errata And Data Sheet Clarification

• PCN - 28-Jun-2011 - Microchip Is Announcing The Qualification Of 121L Xbga (10X10) With Ds7409Hgb Substrate At Anap Asse

• PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 29-Jul-2011 - Additional Fabrication Site: Qualification Of Mask Ypaax At An Additional Wafer Fabrication Site

• PCN - 06-Mar-2009 - Mplab C For Pic32 V1.05 Has Been Released To The Web

• PCN - 04-Oct-2012 - Errata-Pic32Mx320/340/360/440/460 Family Silicon Errata And Data Sheet Clarification Errata

• PCN - 04-Apr-2011 - Microchip Is Announcing The Qualification Of Mask Ypaax At An Additional Wafer Fabrication Site For

• PCN - 20-Apr-2010 - Microchip Has Released A New Devicedoc For The Pic32Mx3Xx/4Xx Family Data Sheet Of Devices.

• PCN - 12-Oct-2009 - New Features Are Added To Mplab Ide V8.40

• PCN - 14-Mar-2012 - Microchip Is Announcing The Qualification Of Ypaa And Tdaa Masks Without Polyimide Process For The L

• PCN - 04-Mar-2011 - Microchip Is Announcing The Qualification Of Ypaa And Tdaa Masks Without Polyimide Process For The L

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 01-Sep-2011 - Qualification Of Ypaa And Tdaa Masks Without Polyimide Process.

• PCN - 16-Feb-2012 - Pic32Mx3Xx/4Xx Family Silicon Errata And Data Sheet Clarification Errata Document Revision

• PCN - 20-Apr-2010 - Data Sheet-Pic32Mx3Xx/4Xx Family Data Sheet

• PCN - 19-Dec-2011 - Microchip Is Announcing The Final Qualification Of 121L Xbga (10X10) With Ds7409Hgb Substrate At Ana

• PCN - 25-Aug-2011 - Microchip Is Announcing The Qualification Of Ymask Ypaax At An Additional Wafer Fabrication Site For

• PCN - 08-Sep-2010 - Errata-Pic32Mx3Xx/4Xx Family Silicon Errata And Data Sheet Clarification

• PCN - 27-May-2011 - Additional Fabrication Site: Qualification Of Mask Ypaax At An Additional Wafer Fabrication Site.

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 24-Nov-2010 - Errata-Pic32Mx3Xx/4Xx Family Silicon Errata And Data Sheet Clarification

• PCN - 23-Jul-2012 - Microchip Is Announcing The Qualification Of Mask Ypaax As An Additional Wafer Fabrication Site For

• PCN - 14-Mar-2012 - Microchip Is Announcing The Qualification Of Ypaa And Tdaa Masks Without Polyimide Process For Liste

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