Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
HSS29-302513P
Stamped Heat Sink - TO-263 - Copper - Surface Mount (SMT) - No Pin
Extruded Heat Sink - TO-218 - 3.5 mm Vertical Solder Pin
Extruded Heat Sink - TO-220 - 2.3 mm Vertical Solder Pin
BGA Heat Sink - 27.9 x 27.9 mm - Aluminum - PCB
Extruded Heat Sink - TO-220 - 4 mm Vertical Solder Pin
Stamped Heat Sink - TO-220 - Copper - Surface Mount (SMT) - 3.2 mm Horizontal Solder Pin
Extruded Heat Sink - Aluminum - PCB
HSE16-384225P-CP
Stamped Heat Sink - TO-220 - 9.5mm Horizontal Solder Pin