Hirose first appeared on the international stage in 1968 and has crafted a network of sales offices, agents and production facilities around the world. The company continues to broaden the scope of its business activities, keeping pace with market advances and satisfying the changing connector needs of companies around the globe. Hirose's vigorous international strategy rests on three pillars:
BGA Heat Sink - 40 x 40 mm - Aluminum - PCB
Extruded Heat Sink - TO-220 / TO-218 - 4 mm Vertical Solder Pin
HSE13-254225P
Stamped Heat Sink - TO-220 - Aluminum - PCB - 5 mm Solder Pin
HSS-C200-SMT-TR
Stamped Heat Sink - TO-220 - Aluminum - PCB - No Pin
Stamped Heat Sink - TO-218 or TO-220 - Aluminum - PCB - 3.8mm Horizontal Solder Pin
Extruded Heat Sink - TO-218 - 3.5 mm Vertical Solder Pin
BGA Heat Sink - 37.4 x 37.4 mm - Aluminum - PCB
Extruded Heat Sink - TO-220 - 3.5 mm Vertical Solder Pin