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MCP6S93T-E/UN

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MCP6S93-E/UN

Microchip Technology

in magazzino: 0

L'ORDINE MINIMO: 100

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MCP6S93T-E/UN

Name: MCP6S93T-E/UN
Brand: Microchip Technology
SKU: 47049378
Price: 2.27 EUR
Availability: InStock

Microchip Technology

MCP6S93 Series 5.5 V 18 MHz Single-Ended Rail-to-Rail I/O Low-Gain PGA - MSOP-10

Scheda dati ACCESSORI Notify Me

RoHS Compliant

REEL Imballaggio

Certificate of Compliance Guarantee

Descrizione +

MCP6S93 Series 5.5 V 18 MHz Single-Ended Rail-to-Rail I/O Low-Gain PGA - MSOP-10

Search Keywords: MCP6S93TEUN

Specifiche +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
fornitore:

Microchip Technology
Codice componente:

MCP6S93T-E/UN
Unità di misura:

per Each
RoHS :

Yes
HTS:

8542330001
COO:

TH
ECCN:

EAR99
Reel Pack:

2500

Tools/3D Models +

EE CASSETTA DEGLI ATTREZZI

risorse +

Scheda dati

Product Changes +

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 17-Dec-2008 - Microchip Is Qualifying The Change Of Bill Of Materials For 8L & 10L Msop Package With 8200T Epoxy A

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 05-Aug-2008 - Microchip is qualifying G700K old compound for 8L and 10L MSOP (3X3 MM) packaged at ATP assembly to

PCN - 20-Mar-2009 - QUALIFICATION OF 8L & 10L MSOP WITH 8200T EPOXY AND G600 MOLD COMPOUND AT UTL ASSEMBLY

PCN - 09-Jun-2008 - Microchip is changing the material i.e mold compound from MP8000 to G700K for 8L and 10L MSOP packag

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 28-Feb-2009 - Qualification Of 8L And 10L Msop With 8200T Epoxy And G600 Mold Compound At Utl Assembly

PCN - 31-Aug-2008 - QUALIFICATION OF G700K MOLD COMPOUND FOR 8L AND 10L MSOP (3X3 MM) PACKAGES AT ATP ASSEMBLY

PCN - 11-Mar-2009 - Microchip is qualifying the Molding Compound and Epoxy in 8L MSOP & 10L MSOP Package with G600 moldi

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. Visualizza alternative
Different product options available. Visualizza alternative
Different packageing options available. Visualizza alternative
Possible Replacement options available. Visualizza alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

in magazzino: 590

Può essere spedito immediatamente

Manufacturer Stock:

10.000 Può spedire 6/12/26

MOQ per Qtà in magazzino:

250

MOQ per Qtà fuori stock:

625

TEMPO DI CONSEGNA DALLA FABBRICA:

20 Weeks Può spedire 19/10/26

PRICE (EUR)

QTÀ

Prezzo unitario

250

€2.27

625

€2.26

1.250

€1.39

1.875

€1.10

2.500 +

€1.08

Reel Package

MCP6S93T-E/UN

Microchip Technology

PRICE (EUR)

Standard Packaging

Reel Packaging

MCP6S93T-E/UN

Microchip Technology

PRICE (EUR)

Standard Packaging

Reel Packaging

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