24LC256-I/P

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• EE CASSETTA DEGLI ATTREZZI
  

• Scheda tecnica

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

• PCN - 16-Mar-2001 - MICROCHIP IS OPENING A NEW FAB LOCATED IN GRESHAM, OREGON

• PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 20-Aug-2018 - UPDATED FIRST LINE MARKING CODES TABLE

• PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

• PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

• PCN - 13-Jan-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 27-May-2010 - 24LC256, 24FC256 and 24AA256 serial EEPROMs will be moved from their current 150K (0.5 micron) fabri

• PCN - 07-Aug-2019 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET CHANGE

• PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 04-Mar-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

• PCN - 10-Dec-2012 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET

• PCN - 28-May-2013 - QUALIFICATION OF AN ADDITIONAL FABRICATION SITE AND 220K PROCESS TECHNOLOGY FOR 24LC256 DEVICE

• PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

• PCN - 07-May-2008 - Microchip is qualifying the G600 mold compound for 8L PDIP package at UNIS in order to improve manuf

• PCN - 26-Nov-2013 - 24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

• PCN - 01-Nov-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 05-Nov-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 13-Jul-2011 - DATA SHEET-24AA256/24LC256/24FC256 DATA SHEET DATA SHEET DOCUMENT REVISION

• PCN - 28-Aug-2008 - Microchip is qualifying the G600C Mold Compound and 8361 J Die attach Epoxy for 8L, 14L, and 16L PDI

• PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE

• PCN - 15-Jun-2011 - QUALIFICATION OF MEMORY PRODUCTS WITH PALLADIUM COATED COPPER (CUPD) WIRE AT MTAI ASSEMBLY SITE

• PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 08-Oct-2010 - Microchip is announcing the quallification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for th

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

• PCN - 19-Apr-2010 - Microchip is announcing the qualification of 8L, 14L, & 16L PDIP at GTK (GRTK) assembly site for the

• PCN - 24-Jun-2008 - Microchip is qualifying a new assembly site of 8L PDIP .300" package Linear Devices, Mixed Signal De

• PCN - 19-May-2008 - ADDING NEW ASSEMBLY SITE

• PCN - 31-Oct-2008 - QUALIFICATION OF G600C MOLD COMPOUND AND 8361J DIE ATTACH EPOXY AT ANAP ASSEMBLY

• PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP AT MMS ASSEMBLY

• PCN - 22-Jan-2004 -

• PCN - 17-Jun-2008 - Microchip is announcing the qualification of G600 mold compound for 8L PDIP package at units for the

• PCN - 19-Sep-2008 - Microchip is qualifying E500 Mold Compound and 84-1LMISR4 Die Attach Epoxy for 8L PDIP Package at MM

• PCN - 01-Sep-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 01-Jun-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

• PCN - 11-Oct-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 10-Dec-2012 - 24AA256/24LC256/24FC256 DATA SHEET

• PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

• PCN - 17-Sep-2006 - QUALIFICATION OF 8L TSSOP AT VGT

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 06-Nov-2003 -

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

• PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

• PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

• PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 30-Nov-2007 - CHANGE IN BOM

• PCN - 13-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 15-Sep-2008 - Microchip is changing the bill of material by changing the mold compound to G600C and Die Attach Epo

• PCN - 26-Nov-2013 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

• PCN - 30-Apr-2020 - QUALIFICATION OF G600V AS AN ADDITIONAL/ALTERNATIVE MOLD COMPOUND MATERIAL

• PCN - 04-Apr-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

• PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 06-Mar-2006 -

• PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

• PCN - 11-Nov-2004 -

• PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA256/24LC256/24FC256 data sheet of devices

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE

• PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

• PCN - 01-Mar-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

• PCN - 15-Oct-2008 - QUALIFICATION OF E500 MOLD COMPOUND AND 84-1LMISR4 DIE ATTACH EPOXY FOR 8L PDIP PACKAGE AT MMS

• PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 03-Apr-2013 - DATA SHEET - 24AA256/24LC256/24FC256 DATA SHEET DOCUMENT REVISION

• PCN - 07-Oct-2005 -

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 28-Apr-2011 - Microchip is announcing the qualification of listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP, 8L

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 27-Mar-2013 - Microchip is announcing the qualification of an additional fabrication site and 220K process technol

• PCN - 22-Jan-2004 - QUALIFY MTAI ASSEMBLY FOR LARGE PADDLES (82X94 MILS AND 84X105.6 MILS)

• PCN - 01-Jan-2006 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

• PCN - 01-Jul-2010 - CONVERSION OF 24LC256, 24FC256 AND 24AA256 PRODUCT FAMILIES TO 160K TECHNOLOGY

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

• PCN - 10-Dec-2012 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices.

• PCN - 14-May-2010 - Microchip has released a new DeviceDoc for the 24AA256/24LC256/24FC256 Data Sheet of devices.

• PCN - 03-Apr-2013 - Microchip has released a new devicedoc for the 24AA256/24LC256/24FC256 data sheet of devices in orde

• PCN - 01-Apr-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT ALPH(MMT) ASSEMBLY SITE

• PCN - 19-Nov-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 01-Nov-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 25-Oct-2021 - DATA SHEET - 24AA256/24LC256/24FC256 256 KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

• PCN - 31-May-2008 - QUALIFICATION OF G600 MOLD COMPOUND FOR 8L PDIP PACKAGE AT UNIS

• PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 23-Apr-2001 -

• PCN - 01-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MMT ASSEMBLY SITE

• Product Change Notification