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593202B03500G
Boyd Laconia LLC
The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor ...
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Descrizione
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The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
Search Keywords: 593202B03500G
Specifiche
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Product AttributeAttribute Value Select Attribute
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fornitore:Boyd Laconia LLC
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Codice componente:593202B03500G
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Alias/AKA:042686
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Unità di misura:per Each
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RoHS :Yes
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HTS:8473309000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
800 -
Device Cooled:TO-220
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Attachment Method:N/A
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Dimension:35.05 x 12.2 x 50.8mm
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Thermal Resistance:10.4 °C/W
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Finish:Black Anodized
risorse
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
in magazzino:
8.045
Spedizione oggi, if you order in
MOQ per Qtà in magazzino:
5
MOQ per Qtà fuori stock:
400
6 Weeks
Può spedire
2/7/26
PRICE (EUR)
QTÀ
Prezzo unitario
5
€2.579
100
€0.658
250
€0.645
400
€0.620
800
€0.603
1.200
€0.600
1.600 +
€0.597
Click for Quote
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