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593202B03500G

Boyd Laconia LLC

The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor ...

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Descrizione +
The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
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Specifiche +
  • Product Attribute
    Attribute Value Select Attribute
  • fornitore:
    Boyd Laconia LLC
  • Codice componente:
    593202B03500G
  • Alias/AKA:
    042686
  • Unità di misura:
    per Each
  • RoHS :
    Yes
  • HTS:
    8473309000
  • COO:
    CN
  • ECCN:
    EAR99
  • Supplier Standard Pack: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    800
  • Device Cooled:
    TO-220
  • Attachment Method:
    N/A
  • Dimension:
    35.05 x 12.2 x 50.8mm
  • Thermal Resistance:
    10.4 °C/W
  • Finish:
    Black Anodized
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in magazzino: 8.045
Spedizione oggi, if you order in
MOQ per Qtà in magazzino:
5
MOQ per Qtà fuori stock:
400
6 Weeks Può spedire 2/7/26
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PRICE (EUR)
QTÀ
Prezzo unitario
5
€2.579
100
€0.658
250
€0.645
400
€0.620
800
€0.603
1.200
€0.600
1.600 +
€0.597
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