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Image is representational - see mfr. specs
375424B00034G
Boyd Laconia LLC
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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RoHS Compliant
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Descrizione
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
Specifiche
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Product AttributeAttribute Value Select Attribute
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fornitore:Boyd Laconia LLC
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Codice componente:375424B00034G
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Alias/AKA:042987
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Unità di misura:per Each
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RoHS :Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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EE CASSETTA DEGLI ATTREZZI
risorse
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Scheda dati
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
in magazzino:
3.694
Può essere spedito immediatamente
Minimum Order Quantity:
25
6 Weeks
Può spedire
30/6/26
PRICE (EUR)
QTÀ
Prezzo unitario
25
€1.065
250
€0.799
500
€0.759
1.000
€0.752
3.360
€0.750
6.720
€0.748
10.080
€0.746
16.800 +
€0.744
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