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DSPIC30F6012A-30I/PT

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DSPIC30F6012AT-30I/PT

Microchip Technology

in magazzino: 0

L'ORDINE MINIMO: 300

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DSPIC30F6012A-30I/PT by microchip technology

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DSPIC30F6012A-30I/PT

Microchip Technology

MCU - 16-bit dsPIC RISC - 144KB Flash - 8KB SRAM - 4KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 64-Pin TQFP - Tray

Scheda dati ACCESSORI Notify Me

RoHS Compliant

TRAY Imballaggio

Certificate of Compliance Guarantee

This product may require extra documentation. Shipping may be delayed 1-2 days.

Descrizione +

MCU - 16-bit dsPIC RISC - 144KB Flash - 8KB SRAM - 4KB EEPROM - -40°C to +85°C - 2.5V/3.3V/5V - 64-Pin TQFP - Tray

Search Keywords: DSPIC30F6012A30IPT

Specifiche +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
fornitore:

Microchip Technology
Codice componente:

DSPIC30F6012A-30I/PT
Unità di misura:

per Each
RoHS :

Yes
HTS:

8542310020
COO:

TH
ECCN:

3A991.a.2
Supplier Standard Pack:

160
Program Memory Size:

144 KB
Program Memory Type:

Flash
Number of Programmable I/Os:

52
Operating Temperature:

-40 to 85 °C
ADC Resolution:

12 bit
RAM Size:

8 KB

Tools/3D Models +

EE CASSETTA DEGLI ATTREZZI

risorse +

Scheda dati

Product Changes +

PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 15-Nov-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 64L TQFP PACKAGE WITH PALLADIUM COATED COPPER

PCN - 11-Feb-2010 - ERRATA-DSPIC30F6011/6012/6013/6014 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

PCN - 11-Nov-2004 - Product Change Notice

PCN - 27-Jul-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 07-Jun-2011 - ERRATA-DSPIC30F6011A/6012A/6013A/6014A FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOC

PCN - 04-Feb-2011 - Microchip has released a new devicedoc for the dsPIC30F6011A/6012A/6013A/6014A data sheet of devices

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 14-Dec-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

Product Change Notification

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. Visualizza alternative
Different product options available. Visualizza alternative
Different packageing options available. Visualizza alternative
Possible Replacement options available. Visualizza alternative
Item discontinued
End of Life: Final orders must be placed by
Item discontinued

in magazzino: 361

Spedizione oggi, if you order in

Manufacturer Stock:

14 Può spedire 6/1/26

Minimum Order Quantity:

TEMPO DI CONSEGNA DALLA FABBRICA:

5 Weeks Può spedire 24/6/26

PRICE (EUR)

QTÀ

Prezzo unitario

€9.23

€8.81

€8.69

160

€8.44

320

€8.42

640

€8.40

1.120 +

€8.38

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DSPIC30F6012A-30I/PT

Microchip Technology

PRICE (EUR)

Standard Packaging

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DSPIC30F6012A-30I/PT

Microchip Technology

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Standard Packaging

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