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Image is representational - see mfr. specs
375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Scheda dati ACCESSORI Notify Me
RoHS Compliant
Bulk Imballaggio
Certificate of Compliance Guarantee
Descrizione
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
Specifiche
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Product AttributeAttribute Value Select Attribute
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fornitore:Boyd Laconia LLC
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Codice componente:375324B00035G
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Alias/AKA:035731
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Unità di misura:per Each
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RoHS :Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Supplier Standard Pack:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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EE CASSETTA DEGLI ATTREZZI
risorse
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Scheda dati
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
in magazzino:
3.316
Spedizione oggi, if you order in
MOQ per Qtà in magazzino:
5
MOQ per Qtà fuori stock:
480
9 Weeks
Può spedire
4/8/26
PRICE (EUR)
QTÀ
Prezzo unitario
5
€6.863
100
€4.279
250
€4.048
480
€3.871
960
€3.771
1.440
€3.698
1.920 +
€3.672
Click for Quote
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