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MCP2551-E/SN

Microchip Technology

en stock: 0

Commande min: 100

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MCP2551T-E/SN

Microchip Technology

CANBus Tranceiver - 1Mbps - Sleep/Standby - 5V - 8-Pin.

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RoHS Compliant

Discontinued

REEL Emballage

Certificate of Compliance Guarantee

Description +

CANBus Tranceiver - 1Mbps - Sleep/Standby - 5V - 8-Pin.

Search Keywords: MCP2551TESN

spécification +

Product Attribute

Attribute Value Select Attribute
Products found: 0 Show Similar
fournisseur:

Microchip Technology
Référence:

MCP2551T-E/SN
Unité de mesure:

Per Each
RoHS:

Yes
HTS:

8542390090
COO:

TH
ECCN:

EAR99
Reel Pack:

1
Category:

Transceiver
Dimension:

4.9 x 3.9 x 1.25(Min) mm

Tools/3D Models +

BOÎTE À OUTILS EE

ressources +

Fiche technique

Product Changes +

PCN - 30-Jul-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

PCN - 11-Nov-2004 - Product Change Notice

PCN - 10-Jul-2010 - Microchip has released a new DeviceDoc for the MCP2551 Datasheet of devices.

PCN - 01-Nov-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 09-Sep-2009 - QUALIFICATION OF NEW WAFER FAB FOUNDRY

PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 08-Nov-2010 - Microchip is announcing the qualification of listed 8 & 14L SOIC package products with SG-8300GM mol

PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

PCN - 22-Jan-2009 - Microchip is qualifying the new wafer fab foundry for MCP1790,MCP200x and MCP2551 products in order

PCN - 15-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

PCN - 22-Jan-2004 - Product Change Notice

PCN - 31-Dec-2010 - QUALIFICATION OF 8 & 14L SOIC PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

PCN - 28-Jun-2005 - Product Change Notice

PCN - 26-May-2005 - Product Change Notice

PCN - 17-Nov-2009 - Microchip is qualifying a new wafer fab foundry for listed products in order to improve production c

PCN - 01-Jan-2005 - CHANGE FROM SNPB (TIN/LEAD) PLATING TO MATTE TIN (SN) PLATING ON THE DEVICE LEADS

PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

Product Change Notification

This product is discontinued, but still in stock.
This product is NOT RoHS Compliant. Voir autre
Different product options available. Voir autre
Different packageing options available. Voir autre
Possible Replacement options available. Voir autre
Item discontinued
End of Life: Final orders must be placed by 10/31/2024
Item discontinued

en stock: 0

Manufacturer Stock:

55 Peut expédier 5/29/26

Commande min Quantitè:

250

PRICE (EUR)

QTÉ

Prix unitaire

€1.3226

250

€1.2024

500

€1.1847

1 000

€1.1671

3 300

€1.1559

6 600

€1.1503

9 900 +

€1.1438

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MCP2551T-E/SN

Microchip Technology

PRICE (EUR)

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