MCP23S17T-E/SS

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• BOÎTE À OUTILS EE
  

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• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 01-Jul-2022 - DOCUMENT CHANGE

• PCN - 14-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 10-Jun-2016 - CANCELLATION - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS

• PCN - 07-Jul-2016 - MCP23017/MCP23S17 DATA SHEET DOCUMENT REVISION

• PCN - 17-Nov-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS

• PCN - 14-Jan-2019 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SSOP package products with SG-8300GM mold co

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 14-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING GOLD (AU) BOND WIRE FOR SELECTED PRODUCTS

• PCN - 14-Jun-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

• PCN - 31-Jan-2018 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 05-Feb-2014 - IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 06-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 11-Nov-2004 -

• PCN - 08-Mar-2007 -

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 08-Mar-2018 - QUALIFICATION OF PALLADIUMCOATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE IN SELECTED PRODUCTS

• PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 12-Sep-2018 - QUALIFICATION OF 8390A DIE ATTACH MATERIAL FOR SELECTED PRODUCTS OF THE 120K, 150K, 160K AND 200K

• PCN - 28-Jun-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 04-Mar-2014 - CANCELLATION NOTICE: IMPLEMENT PIN 1 ORIENTATION CHANGES IN TAPE AND REEL CARRIERS FOR SMSC PRODUCTS

• PCN - 30-Jul-2015 - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS OF THE 150K

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 07-Apr-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 17-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 17-Dec-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

• PCN - 08-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 06-Jul-2017 - QUALIFICATION OF MMT AS AN ADDITIONAL ASSEMBLY SITE USING CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 07-Jun-2016 - CANCELLATION - QUALIFICATION OF CUPDAU BOND WIRE AND G700LS MOLDING COMPOUND IN SELECTED PRODUCTS

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 07-Apr-2011 - Microchip is announcing the qualification of the listed 20 & 28L SSOP packages products with SG-8300

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 08-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE AND 3280 DIE ATTACH EPOXY

• PCN - 23-Sep-2010 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 06-Feb-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 30-Jun-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 04-Jan-2011 - QUALIFICATION OF 20 & 28L SSOP PACKAGES WITH SG-8300GM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• Product Change Notification