DSPIC30F6014A-30I/PT

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• PCN - 22-Jul-2009 - Microchip is qualifying the TQFP package with SG-8300ECM mold compound at MTAI assembly site in orde

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 11-Feb-2010 - ERRATA-DSPIC30F6011/6012/6013/6014 FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION

• PCN - 23-Oct-2009 - Microchip is announcing the final qualification of the TQFP package with SG-8300ECM mold compound at

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 21-Oct-2013 - Microchip is announcing the qualification of the listed products in the 80L TQFP package with pallad

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 27-Jul-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

• PCN - 18-Jun-2007 - QUALIFICATION OF NEW LEADFRAME SUPPLIER LGM USING AG RING PLATED BARE CU PADDLE FOR THE 80L TQFP

• PCN - 07-Jun-2011 - ERRATA-DSPIC30F6011A/6012A/6013A/6014A FAMILY SILICON ERRATA AND DATA SHEET CLARIFICATION ERRATA DOC

• PCN - 20-Mar-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 05-Feb-2014 - IMPLEMENT LABEL AND PACKING CHANGES FOR SMSC PRODUCTS

• PCN - 21-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 80L TQFP PACKAGE WITH PALLADIUM COATED COPPER

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 26-Jun-2007 -

• PCN - 22-Jul-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 11-Nov-2004 -

• PCN - 15-Jun-2015 - QUALIFICATION OF 80L TQFP (12X12X1MM) WITH 280X280 LEAD-FRAME PADDLE SIZE AT ASAC ASSEMBLY SITE

• PCN - 23-Jun-2005 -

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 18-Jun-2007 -

• PCN - 14-Dec-2011 - Microchip is announcing the qualification of 64L, 80L, and 100L TQFP (14x14) packages with C7025 lea

• PCN - 04-Feb-2011 - Microchip has released a new devicedoc for the dsPIC30F6011A/6012A/6013A/6014A data sheet of devices

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 15-Jun-2015 - QUALIFICATION OF 80L TQFP (12X12X1MM) WITH 280X280 LEAD-FRAME PADDLE SIZE AT ASAC ASSEMBLY SITE

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 09-Dec-2005 -

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 13-Dec-2013 - Qualification Of Selected Products Available In The 80L Tqfp Package With Palladium Coated Copper

• PCN - 26-Jun-2007 - Product Change Notice

• PCN - 23-Oct-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE

• PCN - 09-Dec-2005 - Product Change Notice

• PCN - 06-Nov-2009 - QUALIFICATION OF TQFP PACKAGE WITH SG-8300ECM MOLD COMPOUND AT MTAI ASSEMBLY SITE.

• PCN - 23-Jun-2005 - Product Change Notice

• PCN - 31-Aug-2007 - Qualification Of New Leadframe Supplier Lgm Using Ag Ring Plated Bare Cu Paddle For The 80L Tqfp

• PCN - 18-Jun-2007 - Product Change Notice

• PCN - 11-Nov-2004 - Product Change Notice