DSPIC30F4013-30I/P

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• Fiche technique

• PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages

• PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

• PCN - 05-Nov-2008 - Microchip has qualified G600C Mold compound and 8361J Die attach epoxy for 18L PDIP .300" (Dual Dice

• PCN - 01-Dec-2008 - MOLD COMPOUND CHANGE TO G600 & DIE ATTACH EPOXY CHANGE TO 8200T

• PCN - 12-Jul-2006 - QUALIFICATION OF 44L QFN PACKAGE AT NSEB

• PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip And 28L Pdip Packages With Pdcu

• PCN - 18-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages

• PCN - 01-Sep-2009 - MPLAB C for PIC24/dsPIC v3.20 has been released to the web and is available for download. Changes in

• PCN - 27-Sep-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE

• PCN - 18-Nov-2010 - Microchip Has Released A New Devicedoc For The Listed Dspic30F3014/4013 Data Sheet Of Devices.

• PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages

• PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

• PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.

• PCN - 01-Dec-2008 - QUALIFICATION OF 40L PDIP (.6000'') WITH G600 MOLD COMPOUND AT UTL (NSEB) ASSEMBLY

• PCN - 09-Feb-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of CRM-1064L die attach in 28L & 40L PDIP (.600) packages

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 18-Oct-2013 - Qualification Of Selected Products Available In The 40L Pdip & 28L Pdip Packages

• PCN - 15-Nov-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT LPI ASSEMBLY SITE

• PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 18-Nov-2010 - Microchip Has Released A New Devicedoc For The Dspic30F3014/4013 Data Sheet Of Devices.

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 26-Feb-2009 - Microchip has finally qualified G600C Mold compound and 8200T epoxy for 40L PDIP (.600 mil) at UTL (

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 09-Feb-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 10-Oct-2013 - QUALIFICATION OF 28L PDIP AND 40L PDIP PACKAGES AT MMT (ALPH) ASSEMBLY SITE

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 02-Jun-2010 - Errata-Dspic30F3014/4013 Family Silicon Errata And Data Sheet Clarification

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L & 40L PDIP (.600) PACKAGES AT THE MTAI ASSEMBLY SITE.

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• Product Change Notification