25LC512-M/SN

• 

• BOÎTE À OUTILS EE
  

• Fiche technique

• PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 13-Jul-2022 - DATA SHEET - 25LC512 512-KBIT SPI BUS SERIAL EEPROM DATA SHEET DOCUMENT REVISION

• PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 16-Feb-2022 - MANUFACTURING CHANGE

• PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 22-Mar-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

• PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS AVAILABLE IN 8L SOIC PACKAGE

• PCN - 22-Jun-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 18-Aug-2021 - DATA SHEET - 25LC512 DATA SHEET DOCUMENT REVISION

• PCN - 12-Jul-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 08-Apr-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 18-Aug-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 09-Feb-2021 - QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

• PCN - 01-Feb-2022 - CANCEL QUALIFICATION OF A NEW LEAD FRAME DESIGN FOR SELECTED PRODUCTS

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 08-Apr-2015 - QUALIFICATION OF GTK ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS

• PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 20-Mar-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 24-Aug-2015 - QUALIFICATION OF LPI ASSEMBLY SITE AS AN ADDITIONAL SITE FOR SELECTED PRODUCTS IN 8L SOIC PACKAGE

• PCN - 29-Jan-2015 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE FOR SELECTED PRODUCTS WAFER TECHNOLOGIES

• PCN - 07-Apr-2022 - MANUFACTURING CHANGE

• PCN - 12-Apr-2017 - QUALIFICATION OF CUPDAU BOND WIRE IN SELECTED PRODUCTS

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES