25LC256-I/ST

• 

• BOÎTE À OUTILS EE
  

• Fiche technique

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 03-Jun-2004 - QUALIFY UNISEM MALAYSIA FOR ASSEMBLY OF 8L TSSOP PACKAGE FOR PB-FREE RELEASE

• PCN - 17-Jan-2006 - QUALIFICATION OF 8L TSSOP PACKAGE WITH HALOGENFREE MATERIALS AT UNISEM

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 19-Mar-2007 -

• PCN - 02-Nov-2007 - CHANGE IN BOM

• PCN - 28-Jun-2005 - NEW LEADFRAME SUPPLIER FOR 8L SOIC .150

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

• PCN - 12-Apr-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 19-Mar-2007 - QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 08-Jan-2013 - DATA SHEET - 25AA256/25LC256 DEVICE DATA SHEET

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 08-Jan-2013 - Microchip has released a new devicedoc for the 25AA256/25LC256 device data sheet of devices.

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 23-Jul-2021 - DATA SHEET - 25AA256/25LC256 256K SPI BUS SERIAL EEPROM

• PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

• PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

• PCN - 13-Jul-2006 -

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 28-Aug-2019 - MICROCHIP HAS RELEASED A NEW PRODUCT DOCUMENTS FOR THE 25AA256/25LC256 DEVICE DATA SHEET OF DEVICES

• PCN - 15-Oct-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

• PCN - 12-Apr-2012 - Microchip is announcing the qualification of MMT (ALPH) assembly site for the listed 8L TSSOP packag

• PCN - 28-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH BOND WIRE FOR SELECTED PRODUCTS

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 15-Jun-2012 - QUALIFICATION OF 8L TSSOP PACKAGE AT MMT (ALPH) ASSEMBLY SITE

• PCN - 27-Sep-2004 - All standard Microchip devices in the listed packages will change from SnPbplating (standard tin-lea

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 27-Sep-2004 - CHANGE FROM SNPB PLATING TO MATTE TIN PLATING (INDUSTRY-STANDARD PURE SN) OF THE DEVICE LEADS

• PCN - 25-Sep-2007 - Change in shipping box dimensions and lables at MTAI for all Microchip catalog parts Packed in reels

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 26-May-2005 - QUALIFICATION OF 8L SOIC PACKAGE IN STRIP MAGAZINE FORM AT HANA

• PCN - 05-Oct-2007 - Qualification of G700 mold compound in TSSOP packages at ATP!

• PCN - 03-Jun-2004 -

• PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 18-Jul-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

• PCN - 01-Feb-2006 -

• PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 18-Sep-2018 - 25LCXXX 8K-256K SPI SERIAL EEPROM HIGH TEMP FAMILY DATA SHEET

• PCN - 06-Dec-2016 - INITIAL NOTICE- QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

• PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 13-Jul-2006 - QUALIFICATION OF 8L TSSOP AT VGT

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

• PCN - 06-Mar-2006 -

• PCN - 11-Nov-2004 -

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 12-Jan-2017 - FINAL NOTICE - QUALIFICATION OF 35.8K PROCESS TECHNOLOGY FOR SELECTED PRODUCTS

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 02-Sep-2011 - Microchip is announcing the qualification of the listed memory products in 8L SOIC, 8L SOIJ, 8L PDIP

• PCN - 22-Sep-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM MC at ALPH (MMT) assembly site f

• PCN - 09-Sep-2014 - QUALIFICATION OF PALLADIUM COATED COPPER (PDCU) BOND WIRE IN SELECTED PRODUCTS OF 160K AND 150K

• PCN - 15-Mar-2022 - QUALIFICATION OF PALLADIUM COATED COPPER WITH GOLD FLASH (CUPDAU) BOND WIRE

• PCN - 30-Nov-2011 - Microchip is announcing the qualification of 8L SOIC with SG-8300GM mold compound at ALPH (MMT) asse

• PCN - 07-Oct-2005 - 8L SOIJ 208'' PACKAGE QUALIFICATION AT NEW ASSEMBLY PLANT NSE2 (NS ELECTRONICS, BANGKOK)

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS