24LC1025-I/SM

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• BOÎTE À OUTILS EE
  

• Fiche technique

• PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

• PCN - 08-Aug-2013 - Microchip is implementing a convention change to the sales order (SO) number for the listed products

• PCN - 22-Oct-2013 - Microchip is announcing the qualification of the listed 24xx1025, 24xx1026, and 24xx515 device famil

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION

• PCN - 03-Jun-2004 - Microchip is qualifying Amkor Shanghai, China (ATC) as an additional assembly capacity for 8L SOIC p

• PCN - 06-Mar-2006 - QUALIFICATION OF NEW PLATING SITE FOR SNPB & MATTE TIN PLATING

• PCN - 24-Jan-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES AT MTAI, MMT

• PCN - 19-Apr-2010 - QUALIFICATION OF 8L, 14L, & 16L PDIP AT GTK (GRTK) ASSEMBLY SITE.

• PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

• PCN - 19-Jan-2011 - Microchip has released a new DeviceDoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 06-Mar-2006 -

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 18-Apr-2012 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C CMOS seri

• PCN - 28-Apr-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 08-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 08-Nov-2021 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024-KBIT I2C SERIAL EEPROM DATA SHEET DOCUMENT REVISION

• PCN - 11-Dec-2009 - Microchip is moving 160K Double Layer Metal (DLM), (0.4 micron)fabrication process to the 160K Tripl

• PCN - 11-Nov-2004 -

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 13-Jul-2011 - Microchip has released a new devicedoc for the listed 24AA1025/24LC1025/24FC1025 1024K I2C? CMOS Ser

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 19-Feb-2010 - RELEASED A NEW DEVICE DOC

• PCN - 29-Jan-2014 - Microchip is expanding its test facilities to Microchip Thailand (MMT) for all commercial products i

• PCN - 01-Nov-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI

• PCN - 01-Nov-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit

• PCN - 08-Aug-2013 - IMPLEMENT A CONVENTION CHANGE TO THE SALES ORDER (SO) NUMBER

• PCN - 04-Feb-2021 - CUSTOMERS TO IMMEDIATELY PLACE THEIR 12-MONTH NON-CANCELLABLE NON-RESCHEDULABLE BACKLOG ON MICROCHIP

• PCN - 28-Feb-2013 - Microchip is announcing the qualification of 8L SOIJ package without silver plating on the paddle an

• PCN - 02-Nov-2007 - CHANGE IN BOM

• PCN - 31-Jul-2013 - Microchip is announcing the qualification of the listed 8L SOIJ package products without silver plat

• PCN - 19-Jan-2011 - MICROCHIP HAS RELEASED A NEW DEVICEDOC FOR THE SERIAL EEPROM DATA SHEET OF DEVICES.

• PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND LEAD LOCK FEATURE ON LEAD

• PCN - 19-Feb-2010 - Microchip has released a new DeviceDoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS Serial EEPR

• PCN - 12-Aug-2013 - DATA SHEET - 24AA1025/24LC1025/24FC1025 1024K I2C CMOS SERIAL EEPROM DATA SHEET DOCUMENT REVISION

• PCN - 28-Feb-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 31-Jul-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 14-Sep-2005 - QUALIFICATION OF 8L SOIC AT NEW ASSEMBLY SITE VIGILANT,THAILAND

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 23-Jul-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE: IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 10-Oct-2016 - IMPLEMENT PACKING CHANGES WITHOUT INNER BOX FOR MSL 1 MICROCHIP PRODUCTS SHIPPED FROM ALL LOCATIONS

• PCN - 25-Sep-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 11-Dec-2009 - CONVERSION OF 24LC1025, 24FC1025 AND 24AA1025 PRODUCT FAMILIES TO 160K TRIPLE LAYER METAL (TLM)

• PCN - 20-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 03-Aug-2011 - Microchip is announcing the qualification of certain catalog part numbers in the 8L SOIJ package wit

• PCN - 29-Oct-2007 - Change in BOM as well as TOP DIE and/or spacer DIE thickness.

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 23-Sep-2015 - CCB 1727 FINAL NOTICE IMPLEMENT LABEL AND PACKING CHANGES FOR MICROCHIP PRODUCTS

• PCN - 11-Jul-2017 - IMPLEMENT MARKING CHANGES FOR VIRTUALLY ALL ATMEL PRODUCTS

• PCN - 03-Aug-2011 - QUALIFICATION OF CERTAIN CATALOG PART NUMBERS IN THE 8L SOIJ PACKAGE WITH 8006NS DIE ATTACH AT MTAI

• PCN - 12-Aug-2013 - Microchip has released a new devicedoc for the 24AA1025/24LC1025/24FC1025 1024K I2C CMOS serial EEPR

• PCN - 19-Mar-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE

• PCN - 19-Mar-2013 - Microchip is qualifying the listed 8L SOIJ package products without silver plating on the paddle and

• PCN - 07-May-2015 - QUALIFICATION OF A NEW 13 INCH PLASTIC REEL WITH SMALLER WINDOW FOR SELECTED PACKAGES

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 19-Oct-2007 - New assembly site for 24AA /LC/FC Products.

• PCN - 22-Oct-2013 - QUALIFICATION OF 8L SOIJ PACKAGE WITHOUT SILVER PLATING ON THE PADDLE AND WITHOUT LEAD LOCK FEATURE

• PCN - 21-Sep-2015 - INTEGRATION OF THE MICREL PCN SYSTEM WITH THE MICROCHIP PCN SYSTEM

• PCN - 31-Oct-2014 - QUALIFICATION OF HR-5104 DIE ATTACH FILM IN 8L SOIJ PACKAGE AT NSEB (UTL) ASSEMBLY SITE

• PCN - 18-OCT-2023 - Added a new fabrication site

• PCN - 07-NOV-2023 - Added a new fabrication site

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 06-Mar-2006 - Product Change Notice

• Product Change Notification