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Image is representational - see mfr. specs
593202B03500G
Boyd Laconia LLC
The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor ...
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RoHS Compliant
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Description
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The 593202B03500G is a staggered fin, board-level heat sink designed for cooling TO-220 and TO-220-single gauge semiconductor devices.
Search Keywords: 593202B03500G
spécification
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Product AttributeAttribute Value Select Attribute
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fournisseur:Boyd Laconia LLC
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Référence:593202B03500G
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Alias/AKA:042686
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Unité de mesure:Per Each
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RoHS:Yes
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HTS:8473309000
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COO:CN
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ECCN:EAR99
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Référence:
800 -
Device Cooled:TO-220
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Attachment Method:N/A
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Dimension:35.05 x 12.2 x 50.8mm
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Thermal Resistance:10.4 °C/W
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Finish:Black Anodized
Tools/3D Models
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ressources
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
en stock:
835
Peut être expédié immédiatement
sur commande:
8 000
Peut expédier 28/5/26
Quantité minimale de commande pour qté en stock:
5
Quantité minimale de commande pour qté en rupture de stock:
400
13 Weeks
Peut expédier
30/7/26
PRICE (EUR)
QTÉ
Prix unitaire
5
€2.568
100
€0.655
250
€0.642
400
€0.617
800
€0.600
1 200
€0.598
1 600 +
€0.594
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