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Image is representational - see mfr. specs
375424B00034G
Boyd Laconia LLC
The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
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Description
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The 375424B00034G is a square pin fin, board-level heat sink designed for cooling BGA and FPGA devices.
Search Keywords: 375424B00034G
spécification
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Product AttributeAttribute Value Select Attribute
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fournisseur:Boyd Laconia LLC
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Référence:375424B00034G
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Alias/AKA:042987
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Unité de mesure:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Référence:
3360 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:15.2 x 15.2 x 6.356714mm
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Thermal Resistance:62.56717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
en stock:
446
Peut être expédié immédiatement
sur commande:
3 360
Peut expédier 5/6/26
Commande min Quantitè:
25
6 Weeks
Peut expédier
10/6/26
PRICE (EUR)
QTÉ
Prix unitaire
25
€1.035
250
€0.758
500
€0.718
1 000
€0.712
3 360
€0.708
6 720
€0.704
10 080
€0.701
16 800 +
€0.697
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