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Image is representational - see mfr. specs
375324B00035G
Boyd Laconia LLC
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Fiche technique ACCESSOIRES Notify Me
RoHS Compliant
Bulk Emballage
Certificate of Compliance Guarantee
Description
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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 375324B00035G
spécification
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Product AttributeAttribute Value Select Attribute
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fournisseur:Boyd Laconia LLC
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Référence:375324B00035G
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Alias/AKA:035731
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Unité de mesure:Per Each
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RoHS:Yes
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HTS:8542900000
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COO:CN
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ECCN:EAR99
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Référence:
1 -
Device Cooled:BGA6707,FPGA6707
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Attachment Method:Tape6706
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Dimension:10.2 x 10.2 x 10.26714mm
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Thermal Resistance:71.46717°C/W
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Finish:Black Anodized6710
Tools/3D Models
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BOÎTE À OUTILS EE
ressources
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FICHA TÉCNICA
Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
en stock:
3,316
Expédition aujourd'hui, if you order in
Quantité minimale de commande pour qté en stock:
5
Quantité minimale de commande pour qté en rupture de stock:
480
9 Weeks
Peut expédier
28/7/26
PRICE (EUR)
QTÉ
Prix unitaire
5
€6.870
100
€4.284
250
€4.052
480
€3.875
960
€3.775
1 440
€3.702
1 920 +
€3.676
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