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Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized

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Description +
Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4A°C/W Black Anodized
Search Keywords: 035731
spécification +
  • Product Attribute
    Attribute Value Select Attribute
  • fournisseur:
    Boyd Laconia LLC
  • Référence:
    035731
  • Alias/AKA:
    375324B00035G
  • Unité de mesure:
    Per Each
  • RoHS:
    Yes
  • COO:
    CN
  • ECCN:
    EAR99
  • Référence: This information is provided for customers who prefer to buy in multiples of the Manufacturer’s Standard Package quantity. Minimum Order Quantities and Required Order Multiples are presented with our price and availability information.
    1
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Price Match Guarantee
We’ll meet or beat any authorized competitor’s published price for this part.
en stock: 3,316
Peut être expédié immédiatement
Quantité minimale de commande pour qté en stock:
5
Quantité minimale de commande pour qté en rupture de stock:
480
9 Weeks Peut expédier 30/6/26
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PRICE (EUR)
QTÉ
Prix unitaire
5
€6.829
100
€4.258
250
€4.028
480
€3.852
960
€3.753
1 440
€3.680
1 920 +
€3.654
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