PIC16C63A-04/SP

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• BOÎTE À OUTILS EE
  

• Fiche technique

• PCN - 25-Nov-2011 - QUALIFICATION OF 8L,14L,16L,20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

• PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH

• PCN - 15-Feb-2011 - Microchip is announcing the change in package and implementation of new shipping labels for all list

• PCN - 26-Jan-2011 - Microchip is announcing qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (.300

• PCN - 31-Oct-2007 - QUALIFICATION OF GE800 MOLD COMPOUND IN ASSORTED PDIP/SPDIP PACKAGES AT ALPH

• PCN - 03-Jun-2004 - QUALIFICATION OF ABLEBOND 3280 LOW STRESS DIE ATTACH EPOXY IN 28L SPDIP PACKAGE ASSEMBLY AT MTAI

• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS WITH PALLADIUM COATED COPPER (PDCU) BOND WIRE AT MTAI

• PCN - 06-Mar-2006 - Product Change Notice

• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

• PCN - 31-May-2007 - QUALIFICATION OF SAC305 ALLOY SOLDER DIPPING FOR CERDIPS AT MMT

• PCN - 18-Oct-2013 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP, 18L PDIP, AND 8L PDIP PACKAGES

• PCN - 01-Dec-2005 - QUALIFICATION OF 6700HA MOLD COMPOUND FOR 44L/64L TQFP PACKAGES AT MTHAI ASSEMBLY

• PCN - 01-Sep-2005 - QUALIFICATION OF 8L DFN-S WITH G770HCD MOLD COMPOUND AND 8200T DIE ATTACH EPOXY

• PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER

• PCN - 03-Jun-2004 - Product Change Notice

• PCN - 23-Jul-2009 - Microchip is changing the inner box and outer carton for all packages packed in tubes at MTAI assemb

• PCN - 09-Mar-2010 - ERRATA-TIMER1 MODULE DATA SHEET ERRATA

• PCN - 03-Nov-2011 - Microchip is announcing the qualification of 18 & 28L SOIC package with SG-8300GM mold compound at M

• PCN - 05-Aug-2010 - Microchip is announcing the implementation of shipping label and package change for the listed produ

• PCN - 24-Feb-2008 - CHANGE IN INNER BOX LABEL FORMAT TO INCLUDE ADDITIONAL BAR CODE

• PCN - 28-Feb-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 11-Nov-2004 - Product Change Notice

• PCN - 02-Nov-2007 - Microchip is qualifying G600 mold compound in PDIP packages at CEI and NSEB.

• PCN - 30-Mar-2014 - QUALIFICATION OF SELECTED PRODUCTS AVAILABLE IN THE 28L SPDIP PACKAGE WITH PALLADIUM COATED COPPER

• PCN - 30-Jul-2010 - QUALIFICATION OF DIFFERENT PADDLE SIZES IN 18L & 28L SOIC PACKAGES AT MMS (ATES).

• PCN - 12-Nov-2010 - QUALIFICATION OF 28L SPDIP (.300) PACKAGES AT GTK ASSEMBLY SITE.

• PCN - 25-Nov-2011 - QUALIFICATION OF 8L, 14L, 16L, 20L PDIP & 28L SPDIP WITH CRM-1064L DIE ATTACH AT ALPH ASSEMBLY SITE

• PCN - 10-Sep-2009 - CHANGE INNER BOX AND OUTER CARTON FOR ALL PACKAGES PACKED IN TUBES AT MTAI ASSEMBLY SITE

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of the CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PD

• PCN - 23-Sep-2010 - Microchip is announcing the qualification of listed 28L SPDIP (.300) packages products at GTK assemb

• PCN - 21-Oct-2008 - Microchip is changing the Format and adding quantity barcode to the standard die/wafer inner box lab

• PCN - 24-Jan-2008 - Change in Inner Box Label Format MTAI to include additional Bar Code for total quantity of parts shi

• PCN - 26-Oct-2007 - LABEL SIZE CHANGE FROM ALUMINUM BAGS & INNER BOXES 17X4 CM2 TO 14X4 CM2

• PCN - 26-Jan-2011 - Microchip is announcing the qualification of CRM-1064L die attach in 28L SPDIP (.300) & 8/18L PDIP (

• PCN - 31-Mar-2008 - QUALIFICATION OF CRM1706DJ DIE ATTACH EPOXY AND G770HCD MOLD COMPOUND

• PCN - 26-Jan-2009 - Microchip Technology is changing the shipping materials from moisture barrier bag to static shielded

• PCN - 02-Dec-2009 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNPB LEAD/TERMINATION FINISH

• PCN - 11-Jan-2010 - AMEND SHIPPING LABELS FOR CERAMIC PRODUCTS WITH SNAGCU AND AU LEAD/TERMINATION FINISH

• PCN - 09-Nov-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die

• PCN - 08-Oct-2007 - Qualification of GE800 mold compound in assorted PDIP/SPDIP packages at ALPH.

• PCN - 08-Nov-2010 - Microchip is announcing the qualification of the listed 28L SPDIP (.300) packages products at GTK as

• PCN - 08-Mar-2007 - Product Change Notice

• PCN - 01-Jan-2006 - QUALIFICATION OF 8L PDIP PACKAGE AT NEW ASSEMBLY SITE NSE2

• PCN - 30-Jan-2011 - QUALIFICATION OF CRM-1064L DIE ATTACH IN 28L SPDIP (.300) & 8/18L PDIP (.300) PACKAGES

• PCN - 10-Nov-2010 - Microchip is announcing the amended of its previous notice CYER-05LNSD835 which announces the implem

• PCN - 30-Apr-2007 - QUALIFICATION OF NITTO GE800 MOLD COMPOUND FOR PDIP AND SPDIP PACKAGES ASSEMBLED AT MTAI

• PCN - 24-Aug-2011 - Microchip is announcing the qualification of 8L, 14L, 16L, 20L PDIP, & 28L SPDIP with CRM-1064L die